Electronic Package Layout With Stress-Dispersing Rings
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Solution Overview
Problem
Conventional semiconductor packages face issues with non-uniform thermal stress due to mismatches in the coefficient of thermal expansion between semiconductor chips and packaging materials, leading to warpage during thermal cycles.
Innovation Solution
The electronic package design incorporates a carrier structure with an electronic module, a heat dissipation structure, and adjustment structures made of metal or semiconductor materials, where the adjustment structures are rings located around the electronic module to disperse thermal stress, and a layered packaging approach is used to manage thermal expansion differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional semiconductor package uses a large-sized electronic module on a packaging substrate, then the electronic module can be easily mounted and electrically connected, but the mismatch between the coefficient of thermal expansion of the semiconductor chip and packaging material causes non-uniform thermal stress, resulting in warpage during thermal cycles
Solution Approach 1:
The patent introduces adjustment structures as intermediary elements between the heat dissipation structure and the packaging substrate. These adjustment structures serve as a mediator that compensates for the coefficient of thermal expansion mismatch between the semiconductor chip and packaging material, thereby reducing thermal stress and preventing warpage while maintaining ease of assembly
2Productivity
If the electronic module has a large size to meet high-density requirements, then more functional components can be integrated, but the CTE mismatch between semiconductor chip and packaging material becomes more severe, causing greater thermal stress and warpage
Solution Approach 1:
The patent modifies the thermal expansion characteristics of the package structure by introducing adjustment structures with specific material properties and geometric configurations. These structures change the effective thermal expansion parameter of the overall assembly, allowing it to better match the semiconductor chip's CTE and reduce thermal stress during thermal cycling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively disperses thermal stress, preventing warpage of the electronic module during thermal cycling by combining the heat dissipation and adjustment structures, even when the coefficients of thermal expansion of the chip and packaging materials do not match.
Implementation Method 1
a heat dissipation structure coupled with the electronic module
Implementation Method 2
a mismatch between the coefficient of thermal expansion (CTE) of a semiconductor chip 11 and that of a packaging material 15 would easily result in non-uniform thermal stress
Data Source
AI summary
An electronic package is provided in which an electronic module and a heat dissipation structure combined with the electronic module are disposed on a carrier structure, and at least one adjustment structure is coupled with the heat dissipation structure and located around the electronic module. Therefore, the adjustment structure disperses thermal stress to avoid warpage of the electronic module.