Electronic Package Support Layout for Substrate Warpage Relief
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Solution Overview
Problem
Conventional semiconductor packages experience structural warpage due to stress unevenness, leading to reliability issues such as poor ball placement and electrical disconnection.
Innovation Solution
Incorporating a substrate structure with a circuit layer and at least one support member located at the periphery of an electronic module, where the support member is electrically connected to the circuit layer, and forming a first package layer with greater hardness than a second package layer to disperse stress and prevent warping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional semiconductor package is disposed on a package substrate without other elements around it, then the package substrate is prone to stress unevenness, but this results in great warpage causing reliability problems
Solution Approach 1:
The patent introduces support members positioned at specific locations (periphery) of the electronic module on the package substrate. These support members are not uniformly distributed but placed strategically to provide local stress support where needed, preventing warpage at critical areas without requiring a complete redesign of the entire package structure.
Solution Approach 2:
The support members act as intermediary elements between the electronic module and the package substrate. They mediate the stress distribution by providing additional support points that prevent direct stress concentration on the package substrate, thereby preventing warpage and ensuring reliable ball placement while maintaining manufacturing simplicity.
2Device complexity
If the package substrate has no other elements around the semiconductor package, then manufacturing is simpler, but stress unevenness causes warpage
Solution Approach 1:
Rather than adding elements uniformly across the entire package substrate, the invention places support members only at the periphery of the electronic module. This localized approach provides the necessary structural support to prevent warpage while minimizing the increase in device complexity and maintaining a relatively simple package design.
Solution Approach 2:
The package substrate is effectively segmented into functional zones: the central area containing the electronic module and the peripheral area with support members. This segmentation allows different regions to serve different purposes - the center for electronic functionality and the periphery for structural support - thereby preventing warpage without significantly increasing overall complexity.
3Reliability
If a first package layer with greater hardness than a second package layer is used, then stress dispersion is improved, but manufacturing complexity increases
Solution Approach 1:
The patent employs package layers with different hardness characteristics at different locations or depths. The first package layer with greater hardness is positioned to provide primary stress support, while the second package layer with lesser hardness provides additional cushioning. This layered approach with varying local properties improves stress dispersion while using standard packaging materials and processes.
Data Source
AI summary
An electronic package is provided, in which an electronic module and at least one support member are disposed on a substrate structure having a circuit layer, such that the stress on the substrate structure is dispersed through the at least one support member to eliminate the problem of stress concentration and prevent the substrate structure from warping.