Electronic Package Thermal Conductive Layer for Heat Sink Replacement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages face challenges with heat sink detachment due to reduced bonding area from added passive components, leading to potential dislodgment under external forces, and adhesive delamination issues.
Innovation Solution
A thermal conductive layer with varying thickness and materials is applied to cover electronic components and the carrier structure, replacing traditional heat sinks, ensuring secure attachment and improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If passive components are added to the package substrate to improve functionality, then the functionality of the electronic product is enhanced, but the bonding area for the heat sink is reduced
Solution Approach 1:
The patent merges the heat dissipation function with the passive component mounting area by integrating a thermal conductive layer directly onto the package substrate. This eliminates the need for a separate heat sink structure, allowing passive components to be mounted in areas that would traditionally be used for heat sink attachment. The thermal conductive layer serves both as a heat dissipation path and as a substrate for mounting passive components, thereby resolving the conflict between functionality enhancement and bonding area availability.
2Area of stationary object
If the bonding area is reduced, then more space is available for passive components, but the heat sink attachment becomes unreliable and may detach under external forces
Solution Approach 1:
The patent replaces the mechanical attachment system (heat sink with supporting legs bonded to the substrate) with a thermal conductive layer system. Instead of relying on mechanical bonding structures that occupy space and may detach under stress, the invention uses a thermally conductive material layer that provides both thermal management and structural integration. The thermal conductive layer is conformally deposited to ensure reliable attachment without requiring large bonding areas, thus maintaining reliability while providing space for passive components.
3Ease of manufacture
If adhesive layers are used to attach the heat sink, then the heat sink can be mounted on the package substrate, but the adhesive layer may delaminate due to stress from external forces
Solution Approach 1:
The patent changes the material parameter of the thermal interface from traditional adhesive materials to specialized thermal conductive materials with superior mechanical and thermal properties. The thermal conductive layer is formulated to have high thermal conductivity along with enhanced adhesion strength and stress resistance. By changing the material parameters (thermal conductivity, adhesion strength, elasticity), the invention achieves both ease of manufacture and high reliability, preventing delamination under external forces while maintaining effective heat dissipation.
4Temperature
If a conventional heat sink is used for heat dissipation, then heat can be dissipated from the semiconductor chip, but the structure occupies significant space and reduces integration density
Solution Approach 1:
The patent transitions from a three-dimensional heat sink structure (extending vertically above the substrate) to a two-dimensional thermal conductive layer (integrated within the substrate plane). This dimensional change allows heat dissipation to occur within the substrate layer rather than requiring external protruding structures. The thermal conductive layer distributes heat laterally across the substrate area, eliminating the need for bulky heat sink fins and mounting structures, thereby significantly reducing occupied space while maintaining effective heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal conductive layer enhances heat dissipation and prevents detachment of components, maintaining structural integrity under external forces while optimizing space utilization.
Implementation Method 1
a thermal conductive layer contacting and covering the first electronic component and the carrier structure
Data Source
AI summary
The present disclosure provides an electronic package including: a carrier structure having a circuit layer, a first electronic component disposed on the carrier structure and electrically connected to the circuit layer, and a thermal conductive layer applied to the first electronic component and the carrier structure. The present disclosure replaces the conventional method of using heat sinks by coating a thermal conductive layer such as a metal layer, thereby avoiding problems of the heat sink occupying a position of the carrier structure and the heat sink falling off.