Electronic Package Thermal Pillar Structure for Chip Heat Dissipation
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Solution Overview
Problem
Conventional semiconductor packages face challenges in heat dissipation due to the accumulation of heat generated by semiconductor chips, which hinders their ability to meet thermal management requirements.
Innovation Solution
The proposed electronic package incorporates a thermally conductive pillar that extends into the circuit structure, thermally conducting the first metal layer and the second metal layer, allowing for concurrent heat dissipation from both electronic elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor chips are encapsulated by a packaging layer, then the chips are protected and integrated, but heat accumulates and cannot be dissipated effectively
Solution Approach 1:
The packaging structure is segmented into multiple functional layers: a substrate layer for mechanical support, a heat dissipation layer with thermal conductive pillars for heat transfer, and an encapsulation layer for protection. This segmentation allows each layer to perform its specific function optimally without interfering with others.
Solution Approach 2:
Thermally conductive pillars are introduced as intermediary elements between the semiconductor chips and the heat dissipation layer. These pillars serve as thermal bridges that conduct heat from the chips through the encapsulation layer to the heat dissipation layer, enabling efficient heat transfer without compromising chip protection.
2Temperature
If heat is conducted through the encapsulant of the packaging layer, then heat can reach the substrate structure, but the heat dissipation efficiency is insufficient
Solution Approach 1:
The heat dissipation structure employs local quality enhancement by concentrating thermal conductivity in specific regions. The thermally conductive pillars are strategically positioned at locations requiring efficient heat removal, while other regions maintain their protective and structural functions. This localized approach optimizes heat dissipation efficiency without compromising overall package integrity.
Solution Approach 2:
The packaging structure utilizes composite materials with different thermal properties. The encapsulation layer uses materials with moderate thermal conductivity for protection, while the heat dissipation layer incorporates materials with high thermal conductivity (such as metal alloys or ceramic composites) to efficiently conduct heat away from the chips.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates heat generated by the electronic elements to an external environment, preventing heat accumulation and ensuring that thermal management requirements are met.
Implementation Method 1
at least one thermally conductive pillar disposed on the second side of the circuit structure and extending into the circuit structure to thermally conduct the first metal layer and the second metal layer
Data Source
AI summary
An electronic package is provided, in which a first electronic element and a second electronic element are disposed on a first side of a circuit structure and a second side of the circuit structure, respectively, where a first metal layer is formed between the first side of the circuit structure and the first electronic element, a second metal layer is formed on a surface of the second electronic element, and at least one thermally conductive pillar is disposed on the second side of the circuit structure and extends into the circuit structure to thermally conduct the first metal layer and the second metal layer. Therefore, through the thermally conductive pillar, heat generated during operations of the first electronic element and the second electronic element can be quickly dissipated to an external environment and would not accumulate.