Electronic Package Thermal Spreader Layout for Compact Heat Dissipation
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Solution Overview
Problem
As electronic packages shrink and incorporate multiple semiconductor components, heat generation increases, leading to potential performance issues due to inadequate heat dissipation in limited spaces.
Innovation Solution
An electronic package design incorporating a thermal spreading element and encapsulant, where the thermal spreading element is positioned over the electronic component, and the encapsulant covers both, facilitating efficient heat dissipation through the thermal conductive layer, which can include materials like copper or stainless steel, and an adhesive for improved adhesion and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor components are incorporated into a smaller electronic package, then the functionality and integration density are improved, but heat generation increases and heat dissipation becomes more difficult
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat management by positioning the thermal spreading element vertically over the electronic component. This vertical arrangement creates a dedicated heat dissipation pathway that extends in the Z-direction, effectively adding a dimensional aspect to heat management that does not compromise the horizontal integration density of multiple components.
Solution Approach 2:
The thermal spreading element acts as an intermediary between the heat-generating electronic component and the heat dissipation system. It receives heat from the component's back surface and distributes it across a larger area, facilitating efficient heat transfer without interfering with the component's electrical connections or the package's compact layout.
2Temperature
If traditional thermal interface materials are used, then heat transfer is achieved, but delamination and reliability issues occur
Solution Approach 1:
The patent eliminates the thermal interface material layer from the heat dissipation pathway. By directly contacting the thermal spreading element with the electronic component's back surface, it removes the intermediate material that causes delamination, creating a more reliable thermal and mechanical connection.
Solution Approach 2:
The thermal spreading element appears to be constructed from composite or multi-layer materials that provide both thermal conductivity and strong adhesion to the electronic component. This composite structure enables effective heat transfer while maintaining structural integrity and preventing delamination under thermal and mechanical stress.
3Ease of manufacture
If the encapsulant surface is not coplanar with electrical connectors, then manufacturing is simpler, but additional processing steps are required and yield decreases
Solution Approach 1:
The thermal spreading element is positioned and secured to the electronic component before the encapsulant is formed. This preliminary positioning ensures that when the encapsulant is subsequently applied, its surface can be easily made coplanar with the electrical connectors through a single additional processing step, rather than requiring complex adjustments or multiple steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation efficiency, preventing performance degradation by effectively managing heat in compact electronic packages, improving manufacturing yield, and reducing the risk of delamination associated with traditional thermal interface materials.
Implementation Method 1
facilitating efficient heat dissipation through the thermal conductive layer
Data Source
AI summary
A electronic package and a method of manufacturing the same are provided. The electronic package includes an electronic component, a thermal spreading element, and an encapsulant. The electronic component has a first surface. The thermal spreading element is disposed over the electronic component and has a first surface facing the first surface of the electronic component. The encapsulant covers the electronic component and has a first surface closer to the first surface of the thermal spreading element than the first surface of the electronic component.