Electronic Package Thermal Interface Stabilization for Heat Dissipation
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Solution Overview
Problem
Conventional heat dissipation structures in semiconductor packages face challenges with incomplete bonding and reduced efficiency due to the displacement of indium metal sheets during thermal cycling, exacerbated by the use of adhesive layers that hinder thermal conductivity.
Innovation Solution
An electronic package design incorporating a conductive adhesive composed of a polymer adhesive and metal fillers between the thermal interface material and the back side metallization, limiting displacement and enhancing thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If an adhesive layer is applied to fix the thermal interface material to the back side metallization, then the thermal interface material is prevented from displacing during packaging operations, but the adhesive layer forms an obstacle that prevents complete bonding and reduces heat dissipation performance
Solution Approach 1:
The patent removes the adhesive layer entirely from the interface between the thermal interface material and back side metallization. Instead, it uses a suspension coating method to apply a slurry containing glass beads and binder that creates direct metal-to-metal bonding contact, eliminating the obstacle that adhesive layers create while still providing fixation during packaging operations.
Solution Approach 2:
The patent introduces a suspension coating slurry as an intermediary material containing glass beads and binder. This slurry is applied in a suspended state and then cured to form a fixed coating that provides both mechanical support during handling and thermal conduction pathways through the glass beads, replacing the problematic adhesive layer.
2Weight of moving object
If the indium metal sheet is made thinner and lighter to meet product requirements, then the product becomes thinner and lighter, but the indium metal sheet becomes difficult to align and may be blown away during packaging operations
Solution Approach 1:
The patent applies a suspension coating to the back side metallization before mounting the indium metal sheet. This coating cures to form a fixed structure with glass beads that provides mechanical support and positioning features, preventing the thin and light indium sheet from displacing or being blown away during subsequent packaging operations.
Solution Approach 2:
The patent uses a composite coating material consisting of glass beads suspended in a binder. This composite structure provides both mechanical support through the glass beads and adhesion through the binder, creating a stable base that can support thin indium metal sheets without requiring the sheets to be thicker or heavier.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents poor bonding and improves heat dissipation efficiency by stabilizing the thermal interface material, allowing efficient heat transfer through dense metal fillers.
Implementation Method 1
a conductive adhesive provided between the thermal interface material and the back side metallization and including metal fillers
Implementation Method 2
allowing efficient heat transfer through dense metal fillers
Data Source
AI summary
An electronic package is provided and includes a carrier structure, an electronic component disposed on the carrier structure, a heat dissipation structure disposed on the electronic component via a thermal interface material, a back side metallization formed on the electronic component and connected to the thermal interface material, and a conductive adhesive provided between the thermal interface material and the back side metallization. The surface adhesiveness of the conductive adhesive is used to limit the displacement of the thermal interface material relative to the back side metallization, thereby preventing the displacement of the thermal interface material from causing poor bonding between the heat dissipation structure and the electronic component, which would affect the heat dissipation efficiency of the electronic package.