Encapsulated Electronic Package Structure for Warpage Control
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Solution Overview
Problem
Conventional semiconductor packages face issues such as warpage or wavy deformations due to increased volume for functional requirements, which existing solutions like thicker substrates, metal stiffeners, and heat sinks either compromise electrical performance, increase manufacturing costs, or restrict heat dissipation.
Innovation Solution
The proposed electronic package incorporates a carrier structure with a circuit layer, conductive structures exposed from an encapsulation layer, and electronic components connected to the circuit layer, which increases the rigidity of the carrier structure through the encapsulation layer, eliminating the need for heat sinks or stiffeners and maintaining electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the thickness of the package substrate is increased to provide rigidity, then warpage is reduced, but the electrical performance degrades due to increased distance between electronic components
Solution Approach 1:
The package substrate is divided into a thin substrate and a separate stiffener structure. The thin substrate maintains good electrical performance by keeping electronic components close, while the stiffener provides the necessary rigidity to prevent warpage, thus resolving the contradiction between substrate thickness and electrical performance.
Solution Approach 2:
A stiffener is introduced as an intermediary element that provides mechanical support and rigidity to the thin package substrate. This stiffener acts as a mediator between the thin substrate (which ensures good electrical performance) and the requirement for substrate rigidity, preventing warpage without compromising electrical connectivity.
2Stability of the object's composition
If a metal stiffener is added to provide rigidity, then warpage is reduced, but manufacturing cost increases and layout area must be increased
Solution Approach 1:
The stiffener is merged with the package substrate to form an integrated structure. This integration reduces manufacturing complexity by eliminating separate assembly steps for installing a standalone stiffener, while still providing the necessary rigidity to prevent warpage.
Solution Approach 2:
The stiffener structure is designed to serve multiple functions: providing mechanical rigidity to prevent warpage, integrating with the substrate to simplify manufacturing, and potentially serving as a mounting structure for electronic components. This multi-functionality reduces overall device complexity.
3Temperature
If a heat sink is added to improve heat dissipation, then thermal management is enhanced, but manufacturing cost increases and heat dissipation capacity is constrained by TIM heat transfer ability
Solution Approach 1:
The heat dissipation function is merged with the stiffener structure. The stiffener serves dual purposes: providing mechanical rigidity and facilitating heat dissipation. This integration eliminates the need for a separate heat sink, reducing manufacturing complexity while maintaining effective thermal management.
Solution Approach 2:
The stiffener is designed as a multi-functional component that simultaneously provides structural support (rigidity) and thermal management (heat dissipation). This universal design eliminates the need for additional heat sink components, simplifying manufacturing while addressing both mechanical and thermal requirements.
Data Source
AI summary
Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.