Electronic Package Structure for Substrate Warpage Prevention
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Solution Overview
Problem
Conventional semiconductor packages experience structural warpage due to stress unevenness, leading to reliability issues such as poor ball placement and electrical disconnection.
Innovation Solution
Incorporating a substrate structure with a circuit layer and at least one support member located at the periphery of an electronic module, where the support member is electrically connected to the circuit layer, and a harder first package layer is formed to cover the support member and module, dispersing stress and preventing warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the package substrate is disposed alone without surrounding elements, then the manufacturing process is simplified, but stress unevenness occurs causing substrate warpage
Solution Approach 1:
The patent introduces support members specifically at the periphery of the electronic module, creating local structural reinforcement only where needed. This peripheral support structure provides stress distribution and warpage prevention without requiring complete substrate redesign, thus maintaining manufacturing simplicity while improving substrate flatness and stability.
2Stability of the object's composition
If support members are added at the periphery of the electronic module, then substrate warpage is prevented, but device complexity increases
Solution Approach 1:
The support structure is segmented into discrete support members positioned at specific peripheral locations rather than implementing a continuous or comprehensive substrate reinforcement. This segmentation allows the stress distribution function to be achieved with minimal additional components, reducing the impact on device complexity while maintaining substrate flatness.
3Strength
If the first package layer with greater hardness is formed to cover the support member and electronic module, then stress distribution is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent utilizes the hardness parameter difference between the first and second package layers to achieve stress distribution. The harder first package layer provides structural support and stress resistance, while the softer second package layer provides protection and stress absorption. This parameter-based differentiation allows each layer to perform its specific function with standard manufacturing tolerances.
Data Source
AI summary
An electronic package is provided, in which an electronic module and at least one support member are disposed on a substrate structure having a circuit layer, such that the stress on the substrate structure is dispersed through the at least one support member to eliminate the problem of stress concentration and prevent the substrate structure from warping.