Electronic Packaging Structure With Roughened Conductive Block Bonding
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Solution Overview
Problem
Existing packaging technologies face challenges in maintaining reliability and yield due to issues such as difficulty in drilling and poor electroplating effects caused by thick packaging layers, particularly in the context of developing lighter and thinner electronic devices.
Innovation Solution
A packaging device design that includes a conductive block with a rougher first side surface than the packaging layer, enhancing bonding strength through insulation and seed layers, and a manufacturing method that forms these layers to improve adhesion and reduce separation risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thick packaging layer is used to protect the electronic unit, then protection and insulation are improved, but drilling difficulty increases and electroplating effects deteriorate
Solution Approach 1:
The packaging structure is divided into multiple layers: a first packaging layer surrounding the electronic unit, a conductive block filling an opening in the first packaging layer, and a second packaging layer surrounding the conductive block. This segmentation allows each layer to perform its specific function optimally while avoiding the problems of a single thick packaging layer.
Solution Approach 2:
The conductive block is placed locally at the opening position of the first packaging layer to provide localized conductivity and facilitate electroplating only where needed, rather than requiring the entire thick packaging layer to have these properties.
2Stability of the object's composition
If packaging layers are bonded together, then structural integrity is improved, but separation occurs during processing due to thermal expansion differences
Solution Approach 1:
The surface roughness of the conductive block is increased through specific processing to enhance the bonding strength between the conductive block and the packaging layers, compensating for the thermal expansion differences and preventing separation during processing.
3Weight of moving object
If the electronic device is made lighter and thinner, then portability is improved, but reliability and quality requirements become more difficult to meet
Solution Approach 1:
The multi-layer packaging structure with conductive block allows for optimized material usage and localized functionality, enabling lighter and thinner device design while maintaining reliability through targeted protection and bonding enhancement at critical interfaces.
Data Source
AI summary
A packaging device and a manufacturing method thereof are provided. The packaging device includes an electronic unit, a conductive block, and a packaging layer. The conductive block is electrically connected to the electronic unit and has a first side surface. The packaging layer surrounds the electronic unit and the conductive block. A roughness of the first side surface is greater than a roughness of a second side surface of the packaging layer. The manufacturing method of the package device includes: providing a carrier; disposing the conductive block on the carrier, wherein the conductive block has the first side surface; disposing the electronic unit on the carrier; forming the packaging layer on the carrier, so that the packaging layer surrounds the electronic unit and the conductive block; and removing the carrier.