Electronic Packaging Structure With Lateral Conductive Part
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Solution Overview
Problem
In semiconductor packaging, the use of pressing blocks can lead to insufficient heating during welding, reducing the quality of the connection between electronic modules and printed circuit boards due to absorbed welding energy.
Innovation Solution
Incorporating a second conductive part arranged across the lateral surface of the substrate in electronic modules, which contacts solder on the printed circuit board, allowing for improved mechanical strength and reduced open soldering by welding along two or three sides, enhancing the connection quality and flexibility across different packaging modes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a pressing block is used to press the electronic module and printed circuit board tightly during welding, then the warpage-induced open soldering is prevented, but the welding energy is absorbed and the pad heating becomes insufficient
Solution Approach 1:
The patent removes the pressing block from the packaging structure, eliminating the component that absorbs welding energy. The electronic module is packaged directly onto the printed circuit board without additional pressing accessories, thereby preventing energy absorption and ensuring sufficient pad heating during welding.
Solution Approach 2:
The electronic module's substrate utilizes its own lateral surface to provide the pressing function. The lateral surface of the substrate directly contacts and presses against the printed circuit board during welding, eliminating the need for separate pressing blocks while maintaining the necessary mechanical pressure.
2Strength
If traditional packaging methods with pressing blocks are used, then mechanical pressure is applied to prevent open soldering, but the welding energy is absorbed reducing heating efficiency
Solution Approach 1:
The patent combines the mechanical pressing function and the structural support function into a single component - the lateral surface of the substrate. This merged structure provides both the necessary mechanical pressure to prevent open soldering and does not interfere with thermal energy transfer to the pads.
Solution Approach 2:
The patent converts the previously harmful effect of energy absorption by pressing blocks into a beneficial direct contact configuration. The lateral surface of the substrate provides necessary mechanical pressure while allowing welding energy to pass through effectively, transforming the energy transfer issue into an advantage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves the welding quality and mechanical strength between electronic modules and printed circuit boards, reducing the likelihood of open soldering and increasing the flexibility of packaging modes, such as LGA, BGA, and PGA.
Implementation Method 1
a second conductive part (521), arranged across the lateral surface (113) of the substrate (110) and the lower surface (112) of the substrate... allowing for improved mechanical strength and reduced open soldering by welding along two or three sides
Data Source
Figure 1a~1b
Figure 2~3
Figure 4~5a
AI summary
Embodiments of the present invention provide an electronic module and a packaging structure of the electronic module. The electronic module includes: a substrate; at least one electronic component, arranged on an upper surface of the substrate; and a first conductive part and a second conductive part, configured to connect the electronic module to an external printed circuit board; the first conductive part is arranged at a lower surface of the substrate and is electrically connected to the electronic component; and the second conductive part is arranged across a lateral surface of the substrate and the lower surface of the substrate. The electronic module is packaged with the printed circuit board by arranging a second conductive part across the lateral surface of the substrate and the lower surface of the substrate, which improves the quality of welding between the electronic module and the printed circuit board.