Electronic Element Packaging Module with Metal Lead Frame

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Solution Overview

Problem

Conventional system in package structures face issues with vapor absorption leading to popcorn effects during welding, poor thermal conductivity causing heat accumulation, and difficulty in reworking or analyzing damaged components due to encapsulant properties.

Innovation Solution

An electronic element packaging module featuring a patterned metal lead frame with a high thermal conductivity insulating layer and a cap that replaces the conventional encapsulant, allowing for efficient heat dissipation and easy reworking by using a lead frame as a substrate and a cap with improved thermal conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a package encapsulant is used to encapsulate chips, then the chips are protected, but the encapsulant absorbs vapor and causes popcorn effect during welding

Engineering Contradiction:

Improvechip protectionVSAvoidvapor absorption and popcorn effect

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent removes the traditional package encapsulant from the system and replaces it with a lead frame structure. The lead frame provides mechanical support and electrical connection without the vapor absorption problems of encapsulants, effectively extracting the harmful encapsulant material while retaining protective functions.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the material parameter from organic encapsulant to metal lead frame with specific thermal conductivity requirements (≥0.75 W/(m·K)). This parameter change eliminates vapor absorption while maintaining structural integrity and improving thermal management capabilities.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If a package encapsulant is used to encapsulate chips, then the chips are protected, but reworking and failure analysis become difficult

Engineering Contradiction:

Improvechip protectionVSAvoidrework and failure analysis

Core Design Contradiction:

ReliabilityVSEase of repair

Solution Approach 1:

By removing the encapsulant entirely and using an open lead frame structure, the patent makes chips accessible for rework and analysis without requiring destructive encapsulant removal processes, significantly improving ease of repair and failure analysis.

Inventive Principle:

Principle #2Taking out (Extraction)

3Device complexity

If a package encapsulant and wiring board are used, then electronic elements are integrated, but thermal conductivity is poor and heat accumulates

Engineering Contradiction:

Improvesystem integrationVSAvoidheat accumulation

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The patent changes the thermal conductivity parameter by selecting lead frame materials with minimum thermal conductivity of 0.75 W/(m·K) and implementing direct thermal pathways from chips to lead frame to external environment, eliminating heat accumulation while maintaining system integration.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent replaces the traditional encapsulant-based thermal management system with a metal lead frame-based thermal conduction system, utilizing the superior thermal conductivity of metals to efficiently dissipate heat from electronic elements.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances heat dissipation efficiency, prevents vapor absorption, facilitates easy reworking and failure analysis, and improves thermal conduction and electromagnetic shielding by using a metal cap and high thermal conductivity materials.

Implementation Method 1

the lead frame is used as a substrate and a cap with improved thermal conductivity... enhances heat dissipation efficiency... improves thermal conduction

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

improves thermal conduction and electromagnetic shielding by using a metal cap and high thermal conductivity materials

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS8253041B2Electronic element packaging module

Publication Date: 2012.08.28 CYNTEC

AI summary

An electronic element packaging module including a lead frame, an insulating layer and at least one electronic element is provided. The lead frame is a patterned metal sheet and has a first surface, a second surface opposite thereto and a through trench passing from the first surface to the second surface. A substrate portion and a plurality of lead portions around the substrate portion of the lead frame are defined by the through trench. The second surface of the lead frame is exposed outside the electronic element packaging module. The insulating layer disposed in the through trench has a third surface and a forth surface substantially coplanar with the first and the second surfaces, respectively. The electronic element disposed on the first surface is coupled to the lead frame.