Electronic Panel Crack Sensing Pattern and Auxiliary Signal Routing
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Solution Overview
Problem
Existing electronic panels face challenges in efficiently sensing external inputs and maintaining reliability due to the complexity of signal transmission and the presence of through-holes, which can lead to defects in the crack sensing patterns.
Innovation Solution
The electronic panel incorporates a crack sensing pattern with a curved shape extending along the edge of a through-hole, an auxiliary pattern, and a signal line connecting the crack sensing pattern to the auxiliary pattern, allowing for efficient detection signal transmission and easy detection of defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a through-hole is provided in the electronic panel, then the panel can accommodate electronic modules and improve functionality, but the crack sensing pattern may be defective and reliability decreases
Solution Approach 1:
The sensing pattern is divided into multiple segments: a first sensing pattern in the first area, a second sensing pattern in the second area, and a crack sensing pattern around the through-hole. Each segment is independently configured to perform specific sensing functions, allowing the system to maintain reliability despite the presence of the through-hole.
Solution Approach 2:
A bridge pattern is introduced as an intermediary element to electrically connect the first sensing pattern and the second sensing pattern. This bridge pattern compensates for the discontinuity caused by the through-hole, ensuring continuous sensing coverage and maintaining overall sensing reliability.
2Area of stationary object
If sensing patterns are arranged to cover the entire active area, then sensing coverage is improved, but signal transmission complexity increases
Solution Approach 1:
The sensing pattern is segmented into distinct regions: a first sensing pattern for the first area, a second sensing pattern for the second area, and a crack sensing pattern for the through-hole region. This segmentation allows each region to be optimized independently, reducing overall signal transmission complexity while maintaining comprehensive coverage.
Solution Approach 2:
Different sensing patterns are designed with different characteristics suited to their specific locations. The first sensing pattern is optimized for the first area, the second sensing pattern for the second area, and the crack sensing pattern specifically for detecting cracks around the through-hole, ensuring optimal performance in each local region.
3Reliability
If a crack sensing pattern is added to detect defects, then reliability is improved, but device complexity increases
Solution Approach 1:
The crack sensing pattern is merged with the existing sensing patterns in a coordinated manner. The bridge pattern serves dual purposes: it connects the first and second sensing patterns for signal transmission, and simultaneously acts as a crack sensing element. This merging reduces overall complexity while maintaining defect detection capability.
Solution Approach 2:
The bridge pattern is designed to perform multiple functions: it electrically connects the first sensing pattern and the second sensing pattern, provides sensing coverage in the through-hole region, and detects cracks. This multi-functionality reduces the need for separate components, thereby reducing device complexity while improving reliability.
Data Source
AI summary
An electronic panel including: a base substrate including a first area and a second area, wherein the first area includes a module area and a display area adjacent to the module area; a display element layer including a plurality of display elements, wherein the plurality of display elements overlaps the first area; an encapsulation layer configured to cover the display elements; sensing patterns overlapping the first area and disposed on the encapsulation layer; a crack sensing pattern overlapping the module area and disposed on the encapsulation layer; an auxiliary pattern overlapping the module area and disposed on the encapsulation layer, wherein the auxiliary pattern has a shape that extends along an edge of the crack sensing pattern and extends between the sensing patterns and the crack sensing pattern; and a signal line disposed on the encapsulation layer to electrically connect the crack sensing pattern to the auxiliary pattern.