Electronic Panel Layer Structure for Chemical-Resistant Insulation
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Solution Overview
Problem
Existing electronic panels face challenges in maintaining chemical resistance and process reliability, particularly for the organic insulation layer, which is prone to damage during manufacturing and usage.
Innovation Solution
The electronic panel design incorporates a structure with multiple conductive layers, organic insulation layers, and pattern layers, where the pattern layer covers the second conductive layer and exposes specific areas of the first organic insulation layer, enhancing chemical resistance and process reliability by preventing damage during manufacturing and usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the organic insulation layer is made thinner to reduce device thickness, then the device becomes more compact, but the chemical resistance and durability of the organic insulation layer deteriorates
Solution Approach 1:
The patent applies composite materials by combining the organic insulation layer with an inorganic insulation layer to create a multi-layer insulation structure. This composite approach allows the organic layer to be thinner while the inorganic layer provides additional chemical resistance and durability, resolving the contradiction between reduced thickness and maintained reliability.
Solution Approach 2:
The insulation function is segmented into multiple layers: an organic insulation layer and an inorganic insulation layer. This segmentation allows each layer to specialize - the organic layer provides baseline insulation while the inorganic layer reinforces chemical resistance, enabling thinner overall design without sacrificing durability.
2Ease of manufacture
If conventional manufacturing processes are used, then the manufacturing process is simple, but the organic insulation layer is prone to damage during manufacturing
Solution Approach 1:
The inorganic insulation layer is formed beforehand to provide a protective foundation before subsequent manufacturing steps. This preliminary protective layer prevents damage to the organic insulation layer during later processing, improving process reliability without significantly complicating the manufacturing workflow.
Solution Approach 2:
The inorganic insulation layer serves as a protective cushion or barrier that shields the organic insulation layer from potential damage during manufacturing processes. This beforehand protection ensures the organic layer maintains its integrity throughout production, resolving the reliability issue.
3Ease of manufacture
If the organic insulation layer is exposed during manufacturing, then the manufacturing process is straightforward, but the organic insulation layer suffers chemical damage
Solution Approach 1:
The inorganic insulation layer acts as an intermediary protective barrier between the organic insulation layer and harmful chemical factors during manufacturing. It shields the organic layer from chemical damage while allowing the manufacturing process to proceed straightforwardly, resolving both the ease of manufacture and chemical resistance requirements.
Solution Approach 2:
The inorganic insulation layer provides preliminary anti-action by preemptively blocking harmful chemical factors from reaching the organic insulation layer during manufacturing processes. This protective barrier prevents chemical damage before it can occur, maintaining both manufacturing simplicity and material integrity.
Data Source
AI summary
An electronic device includes an electronic panel including an active area and a pad area and including an input sensing member and a circuit board overlapping at least a side of the pad area. The electronic panel includes a first conductive layer, a second conductive layer, a first organic insulation layer disposed between the first conductive layer and the second conductive layer, a pattern layer disposed on the second conductive layer, overlapping the plurality of second conductive patterns, and including a plurality of organic patterns, and a second organic insulation layer covering the pattern layer and the second conductive layer. The pattern layer covers an upper surface of the second conductive layer.