Electronic Panel Support Plate With Glass-Matched Thermal Expansion
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Solution Overview
Problem
The mismatch in thermal expansion coefficients between glass substrates and aluminum plates in LED devices leads to potential damage to lamp boards, posing a challenge in improving the quality and durability of electronic devices.
Innovation Solution
The use of a supporting plate with a thermal expansion coefficient similar to that of the substrate, such as glass, reduces the difference in thermal expansion, thereby minimizing stress and damage to the lamp boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an aluminum plate is attached to the back side of the glass substrate to meet transportation and strength requirements, then the strength and durability of the electronic device are improved, but the mismatch in thermal expansion coefficients between aluminum and glass causes damage to the lamp board
Solution Approach 1:
The patent changes the material parameter (thermal expansion coefficient) of the supporting plate from aluminum (high CTE) to glass or glass-ceramic (low CTE matching the substrate). This parameter change resolves the thermal expansion mismatch problem while maintaining the structural support function, thereby preventing lamp board damage during temperature variations.
Solution Approach 2:
The patent uses glass or glass-ceramic as the supporting plate material, which has similar thermal and mechanical properties to the glass substrate. This homogeneity in material characteristics ensures compatible thermal expansion behavior and reduces internal stresses, eliminating the reliability issue caused by aluminum-glass mismatch.
2Adaptability or versatility
If glass is used as the substrate for mini LED or micro LED lamp boards, then the electronic device can be tiled and meet transportation requirements, but the great difference in thermal expansion coefficient with aluminum plate causes potential damage
Solution Approach 1:
The patent changes the supporting plate material from aluminum to glass/glass-ceramic, matching the thermal expansion coefficient parameter to the glass substrate. This enables the tiled electronic device structure to maintain reliability under thermal stress while preserving the tiling capability and transportation durability.
Solution Approach 2:
The patent employs glass-ceramic as a composite material that combines the low thermal expansion coefficient of glass with enhanced mechanical strength. This composite material serves as an ideal supporting plate that is compatible with glass substrates in tiled configurations, preventing damage while maintaining adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the durability and reliability of electronic devices by reducing the likelihood of damage to lamp boards and facilitating seamless integration in tiled configurations.
Implementation Method 1
the difference of the thermal expansion coefficient between the substrate and the supporting plate is less than or equal to 4 ppm/° K
Data Source
AI summary
The present disclosure discloses an electronic device which includes an electronic panel and a supporting plate. The electronic panel includes a substrate, an electronic component disposed on the first surface of the substrate, and a circuit board disposed on the second surface of the substrate. The first surface is opposite to the second surface, and the electronic component and the circuit board are electrically connected to each other. The supporting plate is arranged under the electronic panel and includes an opening through which the circuit board passes. The difference of the thermal expansion coefficient between the substrate and the supporting plate is less than or equal to 4 ppm/° K.