Electronic Paper Package Structure with Single Adhesive Layer

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Solution Overview

Problem

Current electronic paper package structures require higher costs due to double barrier film bonding and have weaker water vapor barrier capacity, which is a limitation in achieving lightweight, small, and slim display devices.

Innovation Solution

An electronic paper package structure is designed with a single adhesive layer directly bonded between the cover plate and the water vapor barrier film, eliminating the need for an adhesive layer between the cover plate and the electronic ink layer, and incorporating a sealant to enhance water vapor barrier capacity by reducing external water vapor infiltration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If two times of barrier film bonding is used in the current package structure, then the sealing capability is improved, but the manufacturing cost increases and the water vapor barrier capacity decreases

Engineering Contradiction:

Improvesealing capabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the functions of multiple adhesive layers into a single adhesive layer positioned between the cover plate and the water vapor barrier film. This single adhesive layer simultaneously provides sealing and bonding functions that previously required multiple separate adhesive layers, thereby reducing manufacturing cost while maintaining sealing capability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The water vapor barrier film serves as an intermediary element that is directly bonded to the cover plate through the adhesive layer. This configuration allows the water vapor barrier film to act as both a protective barrier and a structural bonding interface, eliminating the need for additional adhesive layers while improving water vapor barrier capacity.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If two times of barrier film bonding is used in the current package structure, then the sealing capability is improved, but the water vapor barrier capacity decreases

Engineering Contradiction:

Improvesealing capabilityVSAvoidwater vapor barrier capacity

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent combines the sealing function and the water vapor barrier function into a single integrated structure where the water vapor barrier film is directly bonded to the cover plate. This eliminates the need for multiple separate barrier films and adhesive layers, thereby improving water vapor barrier capacity while maintaining adequate sealing capability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The package structure employs a composite configuration where the water vapor barrier film, cover plate, and adhesive layer work together as an integrated barrier system. This composite structure provides superior water vapor barrier capacity compared to the conventional multi-layer approach, achieving a water vapor transmission rate below 0.01 g/m2/day.

Inventive Principle:

Principle #40Composite materials

3Ease of manufacture

If a single adhesive layer is used between the cover plate and the water vapor barrier film, then the manufacturing cost is reduced, but the bonding strength may be compromised

Engineering Contradiction:

Improvemanufacturing costVSAvoidbonding strength

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The water vapor barrier film serves as a bonding intermediary that is directly attached to the cover plate through the adhesive layer. This direct bonding configuration between the cover plate and water vapor barrier film creates a strong structural connection that eliminates the need for multiple adhesive layers, thereby reducing manufacturing cost while maintaining adequate bonding strength.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces manufacturing costs and significantly enhances the water vapor barrier capacity, achieving a water vapor transmission rate below 0.01 g/m2/day, while maintaining the lightweight and flexible characteristics of electronic paper displays.

Implementation Method 1

The adhesive layer is directly bonded between the cover plate and the water vapor barrier film to seal the substrate and the electronic ink layer

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Implementation Method 2

The water vapor barrier film covers the substrate and the electronic ink layer... significantly enhances the water vapor barrier capacity, achieving a water vapor transmission rate below 0.01 g/m2/day

Methodology Applied

Scientific EffectWater vapor barrier: Permeation

Data Source

PatentUS11822204B2Electronic paper package structure

Publication Date: 2023.11.21 E INK HLDG INC

AI summary

An electronic paper package structure, including a substrate, an electronic ink layer, a cover plate, a water vapor barrier film and an adhesive layer, is provided. The electronic ink layer is disposed on the substrate. The cover plate covers the electronic ink layer. The water vapor barrier film covers the substrate and the electronic ink layer. The adhesive layer is directly bonded between the cover plate and the water vapor barrier film to seal the substrate and the electronic ink layer. The adhesive layer is not bonded between the cover plate and the electronic ink layer.