Electronic Parts Module Manufacturing Using Adhesive Layer with Solder Particles
Solution Overview
Problem
The existing methods for manufacturing electronic parts modules with both active and passive elements on the same base wiring layer are complex and costly due to the need for different connecting methods, which complicates the production process.
Innovation Solution
A method involving the formation of an adhesive layer with solder particles on the base wiring layer, where the passive element is mounted first, followed by the active element, and then a thermosetting sheet is laminated and thermally pressed to form a resin sealing layer, solidifying the adhesive and melting the solder particles, thus simplifying the production process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If different connecting methods are used for active elements and passive elements, then connection reliability is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent combines the adhesive layer and solder layer into a single integrated structure. The adhesive layer contains solder particles distributed within it, allowing both adhesive bonding and soldering connections to be achieved through a single application process, eliminating the need for separate adhesive and solder deposition steps.
Solution Approach 2:
The adhesive layer serves multiple functions simultaneously: it provides mechanical adhesion to hold the element in place, contains solder particles for electrical connection, and acts as a sealing matrix. This multi-functional design allows the same layer to serve both bonding and connecting purposes for different element types.
2Manufacturing precision
If separate mounting processes are used for passive elements and active elements, then mounting precision is improved, but production time increases
Solution Approach 1:
The adhesive layer with embedded solder particles is applied in advance to all mounting positions before elements are placed. This preliminary preparation allows elements to be mounted sequentially without requiring separate adhesive application steps for each element, reducing overall production time while maintaining precision.
3Strength
If multiple layers (adhesive layer and solder layer) are used, then connection strength is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the adhesive layer and solder layer into a single composite adhesive layer where solder particles are distributed within the adhesive matrix. This eliminates the need for separate adhesive and solder layers, reducing material costs and simplifying the manufacturing process while maintaining both adhesive bonding strength and solder connection strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the production of electronic parts modules with both passive and active elements on the same base wiring layer using simpler and more cost-effective processes, improving the reliability of connections and reducing manufacturing complexity.
Implementation Method 1
a pressing process solidifying the adhesive layer and melting the solder particles by laminating and thermally pressing a thermosetting sheet onto the circuit forming surface so as to form the resin sealing layer
Implementation Method 2
a pressing process solidifying the adhesive layer and melting the solder particles by laminating and thermally pressing a thermosetting sheet onto the circuit forming surface
Data Source
AI summary
The method for manufacturing an electronic parts module includes an adhesive layer forming process forming an adhesive layer including solder particles on the circuit forming surface in range covering at least the first land part and the second land part; a passive element mounting process positioning a terminal of the passive element on the first land part and sticking the passive element to the base wiring layer through the adhesive layer; an active element mounting process, after the passive element mounting process, positioning a terminal of the active element on the second land part and sticking the active element to the base wiring layer through the adhesive layer; a pressing process solidifying the adhesive layer and melting the solder particles by laminating and thermally pressing a thermosetting sheet onto the circuit forming surface so as to form the resin sealing layer.