Electronic Pen PCB Sealing Layout for Waterproof Pressure Resistance
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Solution Overview
Problem
Existing electronic pens face challenges in maintaining a highly waterproof function and resistance to water pressure, particularly when exposed to environments like rain or water bodies, due to the potential deformation and malfunction of circuit components under water pressure and heat exposure.
Innovation Solution
A waterproof electronic pen design featuring a two-layer circuit board with components sensitive to heat on one surface and less sensitive components on the other, sealed by thermosetting resin, and a board holder with recessed portions and projected areas to prevent water ingress and deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If circuit components are sealed using conventional waterproofing methods, then waterproof function is improved, but circuit components may deform or malfunction under water pressure and heat exposure
Solution Approach 1:
The circuit board is divided into two surfaces with different component placements. Heat-sensitive components are positioned on one surface away from the sealing location, while other components are on the opposite surface. This segmentation allows the sealing process to protect against water ingress without exposing heat-sensitive components to damaging temperatures, thereby maintaining both waterproof function and component reliability.
Solution Approach 2:
A sealing member is introduced as an intermediary element between the circuit board and the external environment. This sealing member creates a protective barrier that prevents water from reaching the circuit components while allowing the use of conventional waterproofing methods without directly exposing the components to harmful heat and pressure, thus resolving the contradiction between waterproofing and component protection.
2Reliability
If thermosetting resin is used to seal the circuit board, then waterproofing is improved, but heat exposure may cause component malfunction
Solution Approach 1:
The circuit board is segmented into two surfaces, with heat-sensitive components positioned on the surface farther from the sealing application point. This spatial segmentation ensures that when thermosetting resin is applied for waterproof sealing, the heat generated during curing does not directly affect the heat-sensitive components, allowing effective waterproofing while preventing heat-induced component malfunction.
Solution Approach 2:
The problem is solved by utilizing the third dimension (depth/thickness) of the circuit board structure. By placing heat-sensitive components on one surface and applying the sealing resin on the opposite surface, the patent creates a dimensional buffer that protects sensitive components from heat exposure while maintaining effective waterproof sealing, thus resolving the contradiction between waterproofing and heat protection.
3Device complexity
If circuit board is housed in recessed portion, then structural integration is improved, but water pressure may cause deformation and malfunction
Solution Approach 1:
The recessed portion housing is designed with localized structural features that provide enhanced support and resistance to water pressure at critical areas of the circuit board. This local quality enhancement allows the overall structure to remain integrated and simple while providing targeted reinforcement against water pressure deformation, preventing component malfunction without increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures robust waterproofing and resistance to water pressure, preventing circuit component malfunction and deformation, allowing the pen to function reliably in wet conditions.
Implementation Method 1
a thermosetting resin formed over the second surface of the circuit board seals the opening over the lower surface of the recessed portion of the board housing
Data Source
AI summary
A highly reliable waterproof electronic pen includes a board holder in a board housing including a recessed portion having an opening over a lower surface of the recessed portion. A circuit board is housed in the recessed portion of the board housing. Circuit components easily affected by heat are installed on a first surface of the circuit board, and circuit components not easily affected by heat are installed on a second surface of the circuit board. A thermosetting resin formed over the second surface of the circuit board when the circuit board is housed in the recessed portion seals the opening over the lower surface of the recessed portion of the board housing.