Electronic-Photonic Package Thermal Management
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Solution Overview
Problem
Conventional computer processors are not optimized for the specific data movement and computation patterns required by deep learning algorithms, leading to long processing times, and heat generated by digital controllers disrupts the performance of photonic accelerators used in these algorithms.
Innovation Solution
An electronic-photonic package design that includes a substrate with an interposer and thermally conductive members to efficiently manage heat away from photonic integrated circuits (PICs) and application-specific integrated circuits (ASICs), ensuring stable refractive index and improved performance by separating heat extraction from both sides of the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional CPUs or GPUs are used for deep learning computations, then general-purpose computing capability is provided, but processing speed and efficiency are insufficient due to non-optimized data movement patterns
Solution Approach 1:
The patent replaces conventional electronic computation systems (CPUs, GPUs) with a photonic computing system that uses light instead of electricity for matrix multiplication operations. This substitution enables dramatically faster processing speeds for deep learning workloads by leveraging the parallel nature of optical signal propagation and interference, directly addressing the productivity limitation of electronic systems.
2Adaptability or versatility
If digital controllers are integrated with photonic accelerators in the same package, then control functionality is provided, but heat generated by the digital controller disrupts photonic accelerator performance
Solution Approach 1:
The patent divides the photonic accelerator into multiple independent photonic integrated circuits (PICs), each capable of performing matrix multiplication operations. This segmentation allows for distributed heat management where each PIC can be independently cooled, reducing the impact of thermal interference from the digital controller while maintaining integrated control functionality.
Solution Approach 2:
The patent introduces optical interconnects as an intermediary between the digital controller and photonic accelerators. These optical interconnects transmit control signals and data using light instead of electrical signals, reducing the thermal coupling between the digital controller and photonic circuits while enabling integrated operation.
3Productivity
If multiple PICs and ASICs are co-packaged to enhance computation speed, then processing efficiency is improved, but heat management becomes more challenging
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat management by stacking multiple PICs and ASICs in vertical layers. This dimensional change enables heat to be extracted from multiple surfaces and directions, significantly improving thermal management capability while maintaining high computation speed through close integration of components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the speed and efficiency of deep learning computations by reducing heat-induced refractive index variations in photonic accelerators, allowing for faster and more stable operation of matrix multiplications and other data-intensive tasks.
Implementation Method 1
a heat spreader disposed in the opening and in thermal contact with the first chip
Implementation Method 2
a thermally conductive lid in thermal contact with the second chip
Implementation Method 3
a photonic integrated circuit (PIC)... the PIC comprises a photonic accelerator configured to perform matrix multiplication in an optical domain
Data Source
AI summary
Electronic-photonic packages and related fabrication methods are described. A package may include a plurality of photonic integrated circuits (PICs), where each PIC comprises a photonic accelerator configured to perform matrix multiplication in the optical domain. The package may further include an application specific integrated circuit (ASIC) configured to control at least one of the photonic accelerators. The package further includes an interposer. The plurality of PICs are coupled to a first side of the interposer and the ASIC is coupled to a second side of the interposer opposite the first side. A first thermally conductive member in thermal contact with at least one of the PICs. The first thermally conductive member may include a heat spreader. A second thermally conductive member in thermal contact with the ASIC. The second thermally conductive member may include a lid. The first thermally conductive member faces the first side of the interposer, and the second thermally conductive member faces the second side of the interposer. In some embodiments, the interposer sits in part on a substrate and in part on the PICs.