Electronic Device Sheet With Undulating Insulation Patches
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronic device sheets with thin dielectric layers suffer from dielectric breakdown due to mechanical stress caused by repeated deformation, leading to reduced durability and reliability.
Innovation Solution
An electronic device sheet design featuring a dielectric layer with an insulation patch member having an undulating boundary line, where projecting and recessed portions are strategically positioned to distribute and gradually release mechanical stress, preventing rapid charge accumulation and breakdown.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the dielectric layer is thinned to reduce profile, then the thickness is reduced, but the withstanding voltage and leakage properties deteriorate
Solution Approach 1:
The patent applies local quality by optimizing the material composition, crystalline structure, and orientation of the dielectric layer in specific regions. By controlling the local properties of the dielectric material, the invention achieves improved leakage properties and withstanding voltage even when the overall layer thickness is reduced, thus resolving the contradiction between thinning the dielectric layer and maintaining reliability.
2Duration of action of moving object
If the dielectric layer undergoes repeated mechanical deformation, then the piezoelectric function is maintained, but mechanical stress accumulates causing dielectric breakdown
Solution Approach 1:
The patent introduces an insulation patch member with an undulating boundary line that segments the dielectric layer into multiple regions. This segmentation allows mechanical stress to be distributed across different areas during repeated deformation, preventing stress concentration that would lead to dielectric breakdown. The undulating boundary creates multiple stress release paths, enabling the device to maintain piezoelectric function over extended periods without breakdown.
Solution Approach 2:
The insulation patch member features an undulating boundary line with curved projections and recesses rather than straight edges. This curvature design allows for more uniform stress distribution during mechanical deformation, as the curved surfaces naturally redirect stress flows and prevent sharp stress concentrations at corners or straight edges, thereby improving durability against dielectric breakdown.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses dielectric breakdown and enhances the long-term durability of the electronic device sheet by controlled charge distribution and release, maintaining properties over time.
Implementation Method 1
a dielectric layer (dielectric material) of a capacitor has piezoelectric properties, and thus mechanical deformation due to an inverse piezoelectric effect repeatedly occurs in the dielectric layer
Data Source
AI summary
An electronic device sheet, comprising a pair of electrodes, a dielectric layer provided between the pair of electrodes, and one or more insulation patch members provided on one of principal surfaces of the dielectric layer, wherein the insulation patch member includes a boundary line having an undulating shape.