Electronic Device Signal-Line Detection Before Lighting Tests
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Solution Overview
Problem
Current electronic devices lack a mechanism for real-time detection of signal line abnormalities, leading to potential damage during production or use, which is only detected during the lighting test stage, causing inconvenience to manufacturers and users.
Innovation Solution
An electronic device with a substrate, signal line, detection line, and detection unit, where the detection line is insulated from the signal line and connected to a detection unit that monitors voltage differences to detect abnormalities in the signal line.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If no detection mechanism is provided for signal lines, then the device structure remains simple, but signal line abnormalities cannot be detected in real-time, leading to production waste and user inconvenience
Solution Approach 1:
The detection mechanism is segmented into separate components: detection lines arranged adjacent to signal lines, and detection units electrically connected to the detection lines. This segmentation allows the detection function to be added without complicating the signal transmission path, as each component has a dedicated function.
Solution Approach 2:
Detection lines are introduced as intermediary elements between the signal lines and the detection units. These detection lines are electrically insulated from the signal lines but arranged adjacent to them, serving as mediators that enable indirect monitoring of signal line conditions without direct electrical connection, thus maintaining signal integrity while enabling detection.
2Loss of time
If detection lines are arranged adjacent to signal lines, then real-time detection is enabled, but the manufacturing process becomes more complex
Solution Approach 1:
The detection lines are arranged adjacent to the signal lines during the manufacturing process, before the device is fully assembled and deployed. This preliminary arrangement of detection structures allows for real-time detection capability to be built-in from the outset, enabling early detection of abnormalities during production testing rather than requiring complex post-assembly diagnostic procedures.
3Manufacturing precision
If detection lines are electrically insulated from signal lines, then signal integrity is maintained, but detection sensitivity may be reduced
Solution Approach 1:
The electrical connection between detection lines and signal lines is replaced with a proximity-based detection mechanism. Instead of direct electrical contact, the detection lines are arranged adjacent to signal lines and monitor changes in electrical characteristics (such as capacitance or inductance) that occur when signal lines experience abnormalities, thereby maintaining signal integrity while enabling detection through field interaction rather than direct contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables real-time detection of signal line abnormalities, reducing production waste and user inconvenience by identifying issues before the lighting stage.
Implementation Method 1
The detection line is arranged on the substrate and adjacent to the signal line. The detection unit is electrically connected to the detection line.
Data Source
AI summary
An electronic device includes: a first substrate, a first conductive line, a second conductive line and a first electronic unit. The first substrate has a peripheral area, a first side edge having a first extending direction and a second side edge having a second extending direction not parallel to the first extending direction. The first conductive line is disposed on the first substrate and in the peripheral area. The second conductive line is disposed on the first substrate and adjacent to the first conductive line. The first electronic unit is electrically connected to the first conductive line. Wherein, the first conductive line has a first section disposed between the second conductive line and the first side edge of the first substrate and a second section disposed between the second conductive line and the second side edge of the first substrate, and along a direction perpendicular to the first extending direction, a first distance between the first conductive line and the first side edge of the first substrate is greater than or equal to 50 μm and less than a second distance between the second conductive line and the first side edge of the first substrate.