Electronic Structure Array Supporting Structure Warping
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Solution Overview
Problem
Current semiconductor packaging technologies face issues with warping and insufficient structural strength in chip carriers, leading to manufacturing challenges and increased production costs.
Innovation Solution
The implementation of a supporting structure with bonding protruding portions and encapsulated materials in the electronic structure and array, which alleviates warping and enhances structural strength while reducing production costs by providing additional reinforcement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a circuit board with high wiring density is used as a chip carrier, then the contact number increases, but warping occurs and structural strength becomes insufficient
Solution Approach 1:
The patent uses a composite structure consisting of a circuit board combined with a supporting structure made of different materials (e.g., metal or rigid polymer). This composite design provides both the high wiring density needed for increased contact numbers and the additional structural reinforcement required to prevent warping and improve overall strength.
Solution Approach 2:
The supporting structure is divided into multiple segments including first and second supporting structures positioned at different locations on the circuit board. This segmentation allows the structure to provide distributed reinforcement across the board, effectively preventing warping while maintaining flexibility in design and manufacturing.
2Adaptability or versatility
If a circuit board with high wiring density is used as a chip carrier, then the contact number increases, but warping occurs during manufacturing
Solution Approach 1:
By combining the circuit board with a supporting structure made of materials having different mechanical properties, the composite structure achieves both high wiring density for increased contacts and enhanced dimensional stability to prevent warping during manufacturing and operation.
Solution Approach 2:
The supporting structure extends in dimensions beyond the planar circuit board, providing three-dimensional reinforcement. This additional dimensional support helps counteract the warping forces that occur during manufacturing processes and ensures stable composition throughout the product lifecycle.
3Strength
If supporting structures are added to increase structural strength, then structural strength improves, but production cost increases
Solution Approach 1:
The supporting structure is segmented into multiple parts (first supporting structure, second supporting structure) that can be manufactured separately using standard manufacturing processes and then assembled to the circuit board. This segmentation enables modular production, reducing overall manufacturing complexity and cost while still providing the necessary structural strength enhancement.
Data Source
AI summary
An electronic structure is provided with a redistribution structure and the following elements. A first supporting structure has a first opening and is disposed on a first surface of the redistribution structure. A second supporting structure has a second opening and is disposed on a second surface of the redistribution structure opposite to the first surface. A first bonding protruding portions are disposed on the first surface of the redistribution structure and located in the first opening. A second bonding protruding portions are disposed on the second surface of the redistribution structure and located in the second opening. A first encapsulated material is filled between the first opening and the first bonding protruding portions. A second encapsulated material is filled between the second opening and the second bonding protruding portions. An electronic structure array is also provided.