Electronic Substrate Resin for Low Dielectric Loss and Metal Adhesion
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Solution Overview
Problem
Existing electronic substrate materials face challenges with high transmission loss, dielectric loss, and insufficient adhesion to metal foil or metal plating, particularly at high frequencies, and lack balanced properties such as low dielectric constant, dissipation factor, heat resistance, and solvent solubility.
Innovation Solution
A resin for electronic substrates with specific structural units, controlled terminal hydroxyl group content, and a crosslinking structure, combined with inorganic fillers, to achieve low dielectric properties, reduced thermal expansion, and improved adhesion, using methods like interfacial polycondensation for synthesis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional polycarbonate resin is used for high-frequency electronic substrates, then mechanical properties and thermal resistance are improved, but dielectric properties worsen resulting in high transmission loss
Solution Approach 1:
The invention changes the chemical structure parameters of polycarbonate resin by introducing specific aromatic rings (naphthalene, anthracene, phenanthrene structures) and controlling terminal hydroxyl group content to achieve low dielectric properties while maintaining heat resistance. This structural parameter modification allows the material to exhibit both high thermal stability and low transmission loss at high frequencies.
Solution Approach 2:
The invention creates a composite resin system combining modified polycarbonate with specific additives and fillers to achieve balanced properties. The composite structure integrates the thermal resistance of polycarbonate with the low dielectric properties of carefully selected aromatic structures, resolving the contradiction between heat resistance and transmission loss.
2Strength
If polycarbonate resin is used for coating and molding of thin insulating films, then mechanical strength is improved, but solvent solubility and solution stability are poor
Solution Approach 1:
The invention modifies the molecular weight parameters and terminal group composition of polycarbonate resin to improve solvent solubility while maintaining mechanical strength. By controlling the terminal hydroxyl group content and introducing specific aromatic structures, the resin achieves both adequate mechanical properties and improved processability in coating applications.
3Loss of energy
If the dielectric constant and dissipation factor are reduced for low transmission loss, then energy loss is reduced, but adhesion to metal foil or metal plating deteriorates
Solution Approach 1:
The invention applies local quality modification by introducing specific functional groups and surface characteristics in the resin structure that enhance metal adhesion locally, while the bulk material maintains low dielectric properties. The molecular structure is designed with regions optimized for different functions: low dielectric loss in the bulk and high adhesion at the metal interface.
4Loss of energy
If the roughness of the substrate interface is reduced to improve conductor loss, then transmission loss is reduced, but manufacturing complexity increases
Solution Approach 1:
The invention uses a disposable coating layer approach where a thin insulating film with controlled properties is applied to achieve smooth effective interface without requiring complex substrate surface preparation. The coating itself provides the necessary interface quality, simplifying the overall manufacturing process while reducing conductor loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin exhibits low dielectric constant and dissipation factor, maintaining stability across temperature ranges, with enhanced heat resistance and solvent solubility, suitable for high-frequency applications.
Implementation Method 1
the dielectric constant and dissipation factor of the material used as the insulating material
Implementation Method 2
a crosslinking structure, combined with inorganic fillers, to achieve low dielectric properties, reduced thermal expansion, and improved adhesion
Implementation Method 3
using methods like interfacial polycondensation for synthesis
Implementation Method 4
low thermal expansion to prevent warping of the substrate due to the difference in thermal expansion coefficient between the copper circuit and the insulating layer
Data Source
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AI summary
An electronic substrate material contains a resin having a structure including structures represented by a formula (UN1) and a formula (UN2) or including structures represented by the formula (UN1) and a formula (UN3). In the formulae, * each represent a bond. In the formula (UN1), R1 and R2 each independently represent an organic group having 1 to 12 carbon atoms or the like, and m represents 1 or the like. In the formula (UN2), X is an organic group having 6 to 12 carbon atoms or the like, R3 is an organic group having 1 to 10 carbon atoms, and n represents 1 or the like. In the formula (UN3), Y is a single bond, an organic group having 1 to 10 carbon atoms, or the like, R4 is an organic group having 1 to 10 carbon atoms, R5 is an organic group having 1 to 10 carbon atoms, and p represents 1 or the like.