Electronic Substrate Layout Using Split Same-Potential Power Wirings

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Solution Overview

Problem

The existing multi-chip module substrates require a large number of layers due to the power supply plane occupying a significant area in the conductor layer, which interferes with other wiring patterns, necessitating a dedicated conductor layer and increasing the substrate's layer count.

Innovation Solution

The electronic substrate employs front surface terminals and back surface terminals arranged in arrays to connect semiconductor components, with first and second wirings that supply power from the main substrate, allowing for reduced wiring patterns and eliminating the need for a dedicated power supply conductor layer by ensuring the first and second wirings are not electrically connected within the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a power supply plane is provided to connect all ball electrodes for power supply, then power supply coverage is improved, but the number of layers increases due to interference with signal lines

Engineering Contradiction:

Improvepower supply coverageVSAvoidnumber of layers

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The power supply function is segmented into multiple independent wirings (first wiring, second wiring, third wiring) that can be distributed across different locations. Each wiring connects specific front surface terminals to back surface terminals independently, eliminating the need for a continuous power supply plane and allowing signal lines to be routed in the spaces between these segmented power wirings.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention transitions from a two-dimensional power supply plane occupying conductor layer space to a three-dimensional distributed wiring approach where power supply paths extend through the substrate thickness. By routing power supply through multiple layers via via holes and distributing terminals in both front and back surfaces, the power supply function achieves comprehensive coverage without requiring a dedicated single-layer plane.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If a dedicated conductor layer is provided for power supply plane, then power supply stability is improved, but the area available for other wiring patterns is reduced

Engineering Contradiction:

Improvepower supply stabilityVSAvoidarea for wiring patterns

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

Multiple wirings serve dual functions: they provide power supply to different regions of the substrate while simultaneously acting as spacing elements that organize and separate signal line routing areas. The first, second, and third wirings collectively perform both power distribution and spatial organization functions, eliminating the need for a dedicated single-function power plane.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

Different regions of the substrate receive power supply through locally optimized wiring configurations. The first wiring supplies power to specific front surface terminals in a first region, the second wiring supplies power to front surface terminals in a second region, and the third wiring supplies power to back surface terminals in a third region. This localized power supply approach provides stable power to each region without requiring a continuous plane that would consume overall substrate area.

Inventive Principle:

Principle #3Local quality

3Reliability

If power supply plane occupies wider range over multiple semiconductor components, then power supply coverage is improved, but wiring pattern freedom is reduced

Engineering Contradiction:

Improvepower supply coverageVSAvoidwiring pattern freedom

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS11769720B2Electronic substrate with first and second wirings supplied with same potential

Publication Date: 2023.09.26 AISIN CORP

AI summary

An electronic substrate connects to a semiconductor component via a plurality of front surface terminals disposed in an array on a front surface and connects to a main substrate via a plurality of back surface terminals disposed in an array on a back surface. The electronic substrate includes: a first wiring that electrically connects the front surface terminals and the back surface terminals in the electronic substrate and is supplied with power supply from the main substrate via the back surface terminals; and a second wiring that electrically connects the front surface terminals and the back surface terminals in the electronic substrate, is supplied with power supply having the same potential as the first wiring from the main substrate via the back surface terminals, and is not electrically connected to the first wiring in the electronic substrate.