Electronic Unit Duct for Cooling Heating Elements
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Solution Overview
Problem
The existing electronic apparatuses face challenges in effectively cooling first and second heating elements due to inadequate wind supply, resulting in insufficient cooling capability, especially when the relay boards are vertically disposed and hinder the airflow.
Innovation Solution
The electronic apparatus includes a duct with a guide surface at the end of the first board, directing wind from the fan to the first heating element and ensuring the relay board is horizontally disposed to avoid obstructing airflow, allowing efficient wind supply to both the first and second heating elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If relay boards are vertically disposed to connect first and second boards, then device integration is achieved, but airflow is obstructed and cooling capability deteriorates
Solution Approach 1:
A duct is introduced as an intermediary component between the fan and the first heating element. The duct includes a guide surface that actively directs airflow, serving as a mediator to overcome the obstruction caused by the vertically disposed relay board while maintaining system integration.
Solution Approach 2:
The solution addresses the airflow obstruction in the vertical dimension by introducing a duct with a guide surface that redirects airflow along a different path. This dimensional approach allows air to reach the heating element despite the vertical relay board configuration.
2Reliability
If fan is positioned to cool heating elements, then cooling function is provided, but insufficient wind supply occurs when relay boards block airflow path
Solution Approach 1:
The duct acts as an intermediary that ensures sufficient wind supply reaches the heating element. The guide surface within the duct actively channels and directs the airflow, guaranteeing that the fan's cooling function is effectively transmitted to the heating element despite the presence of vertically disposed relay boards.
3Volume of moving object
If compact arrangement of boards is implemented, then space utilization is improved, but airflow path is blocked by relay boards
Solution Approach 1:
The duct with guide surface serves as a mediator that resolves the conflict between compact arrangement and airflow path. It enables the fan to effectively cool the heating element within the compact vertical board configuration by actively directing airflow around the obstruction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the cooling capability of the first and second heating elements by ensuring a sufficient air supply, improving cooling efficiency and allowing for better ventilation around the fan, as demonstrated by the comparative simulation results showing increased air volume and reduced pressure loss.
Implementation Method 1
a duct disposed at an end on the first side of the first board, the duct having a guide surface that guides wind to the first heating element as a fan of the electronic device operates
Implementation Method 2
The first heating element and the second heating element are cooled by wind that is generated as the fan operates
Data Source
AI summary
An electronic unit to be stored in a first storage section of an electronic device that includes the first storage section on a first side and a second storage section on a second side opposite to the first side, the electronic unit includes a first board on which a first heating element is mounted; a first connector disposed at an end on the first side of the first board; and a duct disposed at the end on the first side of the first board, the duct having a guide surface that guides wind to the first heating element as a fan of the electronic device operates.