Electronic Unit Heat Dissipating Device Dust Sealing
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Solution Overview
Problem
Dust adhesion to electronic parts in projectors, such as red light emitting diodes and DMDs, reduces luminance and image quality due to the difficulty in tightly sealing the connecting surfaces of heat-generating components.
Innovation Solution
An electronic unit with a heat dissipating device, a substrate, and a heat conductive member that positions the end of the conductive member closer to the heat dissipating device than the gap between the substrate and the connecting portion, reducing dust intrusion and enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the connecting surface of the heat dissipating device is sealed tightly to prevent dust adhesion, then dust protection is improved, but heat dissipation performance deteriorates due to thermal resistance increase
Solution Approach 1:
A dust-proof member is introduced as an intermediary component between the heat dissipating device and the substrate. This member includes a sealing portion that contacts the substrate to prevent dust intrusion, while a heat transfer portion that transfers heat from the heat dissipating device to the substrate. The intermediary structure allows simultaneous achievement of dust protection and heat dissipation by separating these two functions into different portions of the same component.
2Object-affected harmful factors
If the gap between the substrate and connecting portion is sealed to prevent dust intrusion, then dust protection is improved, but manufacturing precision requirements increase
Solution Approach 1:
The dust-proof member includes a flexible sealing portion that can deform to conform to the substrate surface. This flexible structure compensates for manufacturing tolerances and gap variations, achieving effective dust sealing without requiring high manufacturing precision. The sealing portion can adapt to slight variations in the gap between the substrate and connecting portion, maintaining sealing effectiveness while reducing manufacturing difficulty.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces dust adhesion to electronic parts, maintaining their performance and improving image quality by ensuring efficient heat dissipation and sealing.
Implementation Method 1
a heat conductive member which is provided between the heat transfer portion of the heat dissipating device and the heat dissipating surface of the electronic part
Implementation Method 2
heat dissipating device having a projecting heat transfer portion
Implementation Method 3
heat dissipating device having a projecting heat transfer portion
Data Source
AI summary
An electronic unit is provided including a heat dissipating device having a projecting heat transfer portion, a substrate on one surface side of which the heat dissipating device is disposed and in which an opening portion where the heat transfer portion is inserted is formed, an electronic part disposed on the other surface side of the substrate so that a heat dissipating surface is positioned in the opening portion and connected to the substrate via a frame-shaped connecting portion disposed with a gap between the substrate and itself, and a heat conductive member provided between the heat transfer portion and the heat dissipating surface and between an outer circumference of the heat transfer portion and an inner circumference of the connecting portion, wherein an end portion of the heat conductive member is positioned closer to the heat dissipating device than the gap between the connecting portion and the substrate.