Electronic Unit Mounting Frame With Perpendicular Insertion Slots
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Solution Overview
Problem
Existing electronics units for hand-held power tools face challenges in assembly complexity and inadequate cooling, with high assembly effort and limited cooling efficiency due to perpendicular fastening of heat sinks that do not directly contact electronic components.
Innovation Solution
The design features a mounting frame with perpendicular insertion slots for electronic components and heat sinks arranged on opposite end faces, allowing direct thermal contact and improved cooling, along with a thermally conductive pad for enhanced heat transfer, and a compact configuration with multiple slots and a T-shaped cross-section for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are individually placed and soldered onto the circuit board, then reliable electrical connections are achieved, but assembly effort and manufacturing time increase significantly
Solution Approach 1:
The mounting frame is segmented into a circuit board section and a slot section, allowing different assembly methods for different components. Components in the slot section are inserted vertically without soldering, while components on the circuit board section can be soldered if needed, enabling parallel assembly processes that improve productivity while maintaining reliability.
Solution Approach 2:
The mounting frame acts as an intermediary structure between the circuit board and the electronic components. It provides pre-formed slots that guide and secure components during insertion, eliminating the need for manual placement and soldering while ensuring reliable mechanical and electrical connections through the frame's integrated design.
2Ease of manufacture
If heat sinks are mounted perpendicularly to the circuit board without direct contact to electronic components, then assembly is simplified, but cooling efficiency is limited
Solution Approach 1:
The heat sinks are positioned in a different spatial dimension - extending horizontally from the slot section rather than mounting vertically to the circuit board. This dimensional change allows the heat sinks to directly contact the laterally mounted electronic components, maximizing thermal contact area while maintaining assembly simplicity through the integrated slot section design.
3Device complexity
If electronic components are mounted on one side of the circuit board, then circuit board layout is simplified, but heat dissipation becomes inadequate
Solution Approach 1:
The mounting frame is divided into two functional sections: a circuit board section for standard PCB mounting and a slot section for vertical component insertion. This segmentation allows heat-generating components to be positioned in the slot section with direct heat sink contact, separating high-heat components from the circuit board layout while maintaining overall design simplicity.
Solution Approach 2:
Different mounting approaches are applied to different locations on the mounting frame. The circuit board section uses traditional PCB mounting for low-to-moderate heat components, while the slot section provides vertical mounting with integrated heat sinks for high-heat components, optimizing local thermal management while maintaining global design simplicity.
4Ease of manufacture
If insertion slots are formed perpendicular to the circuit board for receiving electronic components, then assembly is simplified and cooling is improved, but mechanical protection of components is reduced
Solution Approach 1:
The mounting frame merges multiple functions into a single integrated structure: it provides insertion slots for simplified component mounting, integrates heat sinks for cooling, and incorporates protective elements within the slot section design. This combination maintains assembly simplicity while enhancing both cooling efficiency and component protection simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies assembly, reduces mechanical stress on components, and significantly enhances cooling efficiency by increasing the contact surface between heat sinks and electronic components, thereby extending the service life and protecting components from mechanical influences and contamination.
Implementation Method 1
the at least one heat sink is assigned to the shaft section... increases the contact area between the heat sinks and the electronic components... ensuring particularly effective dissipation of heat
Implementation Method 2
along with a thermally conductive pad for enhanced heat transfer
Data Source
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AI summary
The invention relates to an electronic unit (1) for a hand-held power tool, comprising a mounting frame (2) with a receiving space (3) into which a printed circuit board (6) carrying a plurality of electronic components (5) is inserted, and with at least one heat sink (14) for dissipating heat loss occurring at the electronic components (5). A shaft section (8) with at least one insertion slot (9) oriented perpendicular to the printed circuit board (6) is formed on the mounting frame (2) for receiving an electronic component (5) along an insertion direction (10). The at least one heat sink (14) is associated with the shaft section (8).