Electronic Unit Thermal Isolation via Heat-Resistant Resin Layer
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Solution Overview
Problem
Existing electronic units face challenges in maintaining stable temperature detection due to direct heat transfer from heating components to temperature sensors through interconnections, leading to substrate size increase and stiffness degradation, especially in oscillatory environments.
Innovation Solution
An electronic unit design featuring a heat sink with struts, where the substrate is fixed to the heat sink, and separate interconnections are used for the heating component and temperature sensor, with a slit increasing thermal resistance between them to minimize heat transfer, and a meandering third interconnection ensures continuous temperature detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a notch groove is provided in the substrate around the temperature sensor to suppress heat transfer, then temperature detection stability is improved, but substrate size increases
Solution Approach 1:
The patent introduces a heat-resistant resin layer as an intermediary substance between the heating component and the temperature sensor. This resin layer has high heat resistance and acts as a thermal barrier, preventing direct heat transfer from the heating component to the temperature sensor without requiring additional substrate space for notches or grooves.
Solution Approach 2:
The patent applies local quality by creating a heat-resistant resin layer specifically in the region between the heating component and the temperature sensor, while maintaining the original substrate structure elsewhere. This localized approach provides thermal isolation only where needed, avoiding global substrate size increase.
2Measurement precision
If a notch groove is provided in the substrate around the temperature sensor to suppress heat transfer, then temperature detection stability is improved, but substrate stiffness degrades
Solution Approach 1:
The heat-resistant resin layer serves as a thermal mediator that blocks heat flow without creating physical discontinuities in the substrate. Unlike notch grooves that remove substrate material and create stress concentration points, the resin layer maintains substrate continuity and structural integrity while providing thermal isolation.
Solution Approach 2:
The patent uses a composite structure combining the substrate material with a heat-resistant resin layer. This composite approach provides both thermal isolation and maintains substrate mechanical strength, as the resin layer is integrated with the substrate rather than creating voids or notches.
3Device complexity
If the interconnection extends continuously to the heating component region, then electrical connection is simplified, but direct heat transfer to the temperature sensor occurs
Solution Approach 1:
The heat-resistant resin layer acts as a thermal mediator positioned between the heating component region and the temperature sensor, allowing the interconnection to extend continuously for electrical connectivity while blocking heat transfer paths. The resin layer's high heat resistance prevents thermal conduction through this intermediary zone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for stable temperature detection by the temperature sensor, preventing substrate cracking and maintaining stiffness, while enabling size reduction of the electronic unit.
Implementation Method 1
The heat sink includes a strut. The substrate is fixed to the strut of the heat sink. The first interconnection is provided in a high-temperature region in which the heating component is mounted on the substrate, and is connected to the strut of the heat sink.
Implementation Method 2
The heating component is mounted on the substrate to generate heat upon energization of the heating component.
Data Source
AI summary
An electronic unit includes a heat sink, a substrate, a heating component, a temperature sensor, a first interconnection, and a second interconnection. The heat sink includes a strut. The substrate is fixed to the strut of the heat sink. The heating component is mounted on the substrate to generate heat upon energization of the heating component. The temperature sensor is mounted on the substrate to detect temperature. The first interconnection is provided in a high-temperature region in which the heating component is mounted on the substrate, and is connected to the strut of the heat sink. The second interconnection is provided in a detection region in which the temperature sensor is mounted on the substrate, and is provided separately from the first interconnection. The second interconnection is connected to the strut of the heat sink and the temperature sensor.