Electronics device that dissipates internal device heat via heat sink having exposed surface

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Solution Overview

Problem

Existing electronic devices face challenges in effectively dissipating heat generated internally, which can lead to premature failure and reduced reliability, particularly in compact designs like dome cameras where space for traditional heat sinks is limited.

Innovation Solution

A power-consuming electronics device with a ring-shaped heat sink having an air-exposed surface interposed between complementary housing parts, ensuring a continuous and uniform composite surface for efficient heat dissipation, allowing heat to be radiated to ambient air while maintaining safe internal and external temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional heat sinks are used in compact devices, then heat dissipation is achieved, but device size increases and space is consumed

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoiddevice size

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The heat sink is merged with the housing structure itself, where the housing parts serve dual purposes: structural enclosure and heat dissipation. The first and second housing parts with their exposed surfaces function as integrated heat sinking components, eliminating the need for separate traditional heat sink attachments and reducing overall device volume.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The housing parts are designed to perform multiple functions simultaneously: they provide structural enclosure for the device components and serve as heat dissipation surfaces. This multi-functionality allows the same structural elements to address both mechanical protection and thermal management needs, optimizing space utilization in compact devices.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If heat sink surface area is increased for better heat dissipation, then thermal management improves, but device complexity and component count increase

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidcomponent count

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The housing parts are merged with heat sink functionality, creating an integrated structure that eliminates separate heat sink components. The housing parts themselves become the heat dissipation elements, reducing component count while maintaining effective heat transfer surfaces exposed to ambient air.

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If more space is allocated for heat sinks, then heat dissipation improves, but the compact design advantage is lost

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoiddevice compactness

Core Design Contradiction:

TemperatureVSProductivity

Solution Approach 1:

The housing structure is merged with heat sink functionality, allowing thermal management capabilities to be embedded within the existing structural envelope rather than requiring additional dedicated space. This integration maintains compact device dimensions while providing adequate heat dissipation surfaces.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The housing parts serve dual purposes as both structural enclosure and heat dissipation elements, maximizing the utility of existing device volume and eliminating the need to allocate separate space for thermal management components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables effective heat dissipation from internal components, allowing for increased heat generation within compact devices without exceeding safety standards, reducing the size of external components and maintaining safe operational temperatures.

Implementation Method 1

Heat is drawn away from the device component via the heat sink

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

the heat sink having an air exposed surface... Heat is drawn away from the device component via the heat sink when the electronics device is on and the device component is generating heat

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS10795242B2Electronics device that dissipates internal device heat via heat sink having exposed surface

Publication Date: 2020.10.06 MOTOROLA SOLUTIONS INC

AI summary

A power consuming electronics device that dissipates internal device heat via a heat sink is disclosed. The power consuming electronics device includes first and second complementary housing parts. The first housing part includes a first surface ending at a first peripheral edge, and the second housing part including a second surface ending at a second peripheral edge. The power consuming electronics device also includes a heat sink having an air exposed surface that is interposed between the first and second peripheral edges. Surface edges of the air exposed surface abut the first and second peripheral edges of the housing parts and are respectively matched therewith in shape and dimension so that an overall composite surface formed by the first and second surfaces of the housing parts and the air exposed surface of the heat sink is substantially continuous and uniform.