Electronics Housing Assembly with Segmented Driver Cooling
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Solution Overview
Problem
Traditional arrangements of electronic components in LED-based light fixtures hinder effective heat dissipation due to interference between drivers and impeded heat conduction, leading to reduced efficiency and longevity of the fixtures.
Innovation Solution
The design of electronics housings that physically isolate drivers and promote direct thermal contact with the housing, combined with heat sink fins and air passageways to facilitate heat dissipation through convection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If drivers are arranged end-to-end or side-to-side in the driver housing, then the housing structure is simplified, but heat dissipation is impeded due to thermal interference between adjacent drivers
Solution Approach 1:
The driver housing is segmented into multiple compartments using partition walls, with each compartment housing a separate driver. This segmentation prevents thermal interference between adjacent drivers while maintaining a relatively simple overall housing structure.
2Ease of manufacture
If the driver housing shape prevents multiple surfaces of a driver from contacting the housing, then manufacturing is easier, but heat conduction is impeded
Solution Approach 1:
The housing design incorporates localized thermal contact features including flat contact surfaces and extended surfaces that directly touch multiple surfaces of each driver. These local modifications enhance heat conduction without fundamentally complicating the overall housing manufacturing process.
3Device complexity
If traditional driver housing designs are used, then device complexity is reduced, but heat dissipation efficiency decreases due to blocked air flow paths
Solution Approach 1:
The housing design incorporates three-dimensional air flow passages that extend through the housing structure, allowing air to flow around and between drivers in multiple directions. This dimensional approach to air flow management enhances heat dissipation efficiency without significantly increasing design complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation by creating direct thermal paths and air flow paths, improving the efficiency and longevity of LED-based light fixtures.
Implementation Method 1
a mechanical heat sink located proximate the LED lighting unit and/or LED power supply unit to draw heat away from these components by conduction
Implementation Method 2
The heat sink is exposed to ambient air and heat conducted to the heat sink dissipates over time via convection
Data Source
AI summary
Embodiments of the present invention provide electronics housings that house drivers and other electronics for powering/controlling light sources within a light fixture. The electronics housings are designed to physically isolate the electronics housed within and improve contact between the housing and the electronics to create direct thermal paths for heat dissipation. Heat sink fins may be provided on the electronics housings to create air passageways through which air can move to remove heat from the electronics housings and the light fixtures to which they are attached.