Application-Specific Electronics Packaging for Reel-to-Reel 3D Integration
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Solution Overview
Problem
Current manufacturing processes for molded interconnect devices (MIDs) are inefficient in integrating electronics into smaller spaces with higher functionality, higher speeds, lower power consumption, and reduced heat generation, while also increasing costs.
Innovation Solution
The Application Specific Electronics Packaging (ASEP) system employs a reel-to-reel manufacturing process that involves depositing seed layers of traces on a substrate before electroplating, allowing for the integration of various components like connectors, sensors, and microprocessors, and enables multi-layer functionality by using a stamped carrier and overmolding with electroplating and solder masking steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional batch manufacturing processes are used for MIDs, then manufacturing precision and quality control are maintained, but productivity is low and manufacturing time is long
Solution Approach 1:
The patent implements continuous reel-to-reel manufacturing processes where substrates are continuously fed through molding, laser structuring, and electroplating operations without batch interruptions. This eliminates idle time between batches and maintains continuous production flow, directly resolving the contradiction between maintaining quality and reducing manufacturing time.
Solution Approach 2:
The patent performs laser direct structuring and seed layer deposition on substrates before final assembly and packaging. By preparing the substrate surface and circuit patterns in advance during continuous processing, the system eliminates subsequent time-consuming steps and enables faster final assembly, thereby improving productivity without sacrificing precision.
2Volume of moving object
If electronics are integrated into smaller spaces with higher functionality, then device density and feature count increase, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines multiple manufacturing operations into integrated continuous processes. The molding, laser structuring, seed layer deposition, and electroplating steps are merged into a single continuous production line where substrates pass through each stage sequentially without interruption. This integration reduces the number of separate manufacturing steps and lowers overall complexity despite achieving high device density.
Solution Approach 2:
The patent uses universal equipment that performs multiple functions. The laser system can both struct ure the plastic substrate and prepare surfaces for metallization. The electroplating system can deposit multiple metal layers and patterns in sequence. This multi-functionality reduces the number of specialized equipment pieces needed, thereby reducing manufacturing complexity while enabling sophisticated multi-layer electronic structures in compact spaces.
3Productivity
If reel-to-reel continuous manufacturing is implemented, then productivity and manufacturing efficiency increase, but process control and quality consistency become more difficult
Solution Approach 1:
The patent incorporates real-time feedback control systems that continuously monitor substrate position, laser structuring parameters, seed layer deposition uniformity, and electroplating thickness during continuous reel-to-reel processing. Sensors detect variations and automatically adjust process parameters to maintain consistent quality, resolving the contradiction between high-speed continuous manufacturing and quality control.
Solution Approach 2:
The patent dynamically adjusts process parameters during continuous manufacturing to compensate for variations. The laser power, scanning speed, and focal position are continuously modified based on real-time substrate conditions. Electroplating current density and bath composition are adjusted to maintain uniform metal deposition. These parameter changes enable consistent quality output despite the continuous high-speed production process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables faster, cost-effective, and efficient integration of complex electronic components into three-dimensional structures, reducing manufacturing time and improving conductivity, while allowing for reduced size and weight of electronic products.
Implementation Method 1
electroplating the seed layer of traces to form electronic circuit traces
Data Source
AI summary
Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.