Electronics Shell Heat-Conducting Structure for Thin Sealed Devices
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Solution Overview
Problem
Current electronics, especially mobile phones and tablets, face inefficiencies in heat dissipation due to compact designs and airtight spaces, leading to heat accumulation issues that can cause device shutdowns and battery damage, with existing heat dissipation mechanisms failing to adequately address these problems.
Innovation Solution
A biologically temperature-controlled electronics shell component featuring an outer shell body with integrated heat-conducting sheets that absorb and dissipate radiant heat from semiconductor components, utilizing a combination of metal and plastic materials with strategically placed heat-conducting portions and holes for effective heat transfer, both internally and externally, including biological heat exchange through user contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If cooling parts are scaled down to ultrathin sizes to accommodate thinner electronic products, then the device thickness is reduced, but heat conduction effectiveness deteriorates
Solution Approach 1:
The patent employs composite material structures including heat-conducting sheets with metal cores and plastic coatings, combined with phase change materials and gel substances. This composite approach enables effective heat conduction in ultrathin configurations by leveraging the high thermal conductivity of metal layers while maintaining the thin profile required for modern electronics.
Solution Approach 2:
The patent utilizes phase change materials that alter their physical parameters (phase transitions) in response to temperature changes. This allows the cooling system to dynamically adjust its heat absorption capacity based on thermal conditions, maintaining effective heat conduction even in scaled-down configurations.
2Reliability
If the device body is sealed to prevent moisture damage, then protection against oxidation is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent introduces heat-conducting sheets and thermal interface materials as intermediaries between the sealed device interior and exterior surfaces. These intermediary components conduct heat through the sealed structure without compromising the seal, allowing thermal energy to escape while moisture remains blocked.
Solution Approach 2:
The patent employs capillary channels and porous structures that utilize capillary action to manage heat transfer. These micro-structural features enable thermal conduction pathways through the sealed housing without requiring physical openings that would compromise the seal integrity.
3Temperature
If heat dissipation films are installed on semiconductor components, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent integrates heat dissipation functionality directly into the shell components themselves. The heat-conducting sheets are combined with structural shell elements, merging the protective housing function with thermal management function into a single integrated component, thereby reducing overall device complexity.
Solution Approach 2:
The shell components serve multiple functions simultaneously: structural protection, moisture sealing, and heat dissipation. This multi-functionality eliminates the need for separate dedicated heat dissipation components, reducing the overall complexity of the device architecture.
4Object-affected harmful factors
If a middle shell body is installed to prevent user scalds, then user safety is improved, but heat dissipation contribution deteriorates
Solution Approach 1:
The middle shell body is constructed with composite materials featuring thermal management properties. The shell incorporates heat-conducting layers and phase change materials that enable it to actively participate in heat dissipation while simultaneously providing thermal insulation to protect users from scalds.
Solution Approach 2:
The middle shell utilizes phase change materials that undergo parameter changes (phase transitions) at specific temperature thresholds. This allows the shell to absorb excess heat when temperatures rise, actively contributing to heat dissipation while maintaining a safe external surface temperature for user contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat dissipation and temperature moderation within airtight electronic devices, preventing shutdowns and battery damage by rapidly conducting heat away from semiconductor components, maintaining device functionality and safety while allowing for biological temperature control.
Implementation Method 1
heat-conducting sheet...fast conduction of radiant heat accumulation from heat sources
Implementation Method 2
outer heat-conducting sheet...rapidly conducting heat away from semiconductor components
Implementation Method 3
biologically temperature-controlled electronics shell component...heat-conducting portion contacted by a user
Data Source
AI summary
A biologically temperature-controlled electronics shell component is adapted to constitute an outer shell and/or a middle shell of an electronic product such as a mobile phone, a tablet device, a laptop computer a wearable device, and the like. A heat source is provided in the electronic product. The shell component includes an outer shell body and an outer heat-conducting sheet. The outer shell body includes at least one hole extending through inner and outer surfaces thereof. The outer heat-conducting sheet corresponding to the heat source and combined with the outer shell body includes a heat-conducting portion corresponding to the hole. Radiant heat generated by the heat source can be absorbed by and dissipated through the outer heat-conducting sheet and conducted through a user's skin which is contacting the heat-conducting portion.