Electrooptical Device Mounting Structure With Protruding Lines
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Solution Overview
Problem
In electrooptical devices like liquid crystal devices, signal attenuation occurs due to wiring resistance in the substrate lines, degrading display characteristics and requiring complex impedance matching, while also increasing device size.
Innovation Solution
A mounting structure where the semiconductor device on a substrate is connected to a circuit board with specific bump and line configurations, minimizing signal attenuation by bypassing substrate lines for high-speed signals and optimizing line connections to reduce device size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If signals are input via substrate lines (input lines) on the substrate, then the semiconductor device can be electrically connected to the flexible printed circuit board, but signal attenuation occurs due to wiring resistance and display characteristics are degraded
Solution Approach 1:
The patent segments the signal transmission path by separating high-speed signals from low-speed signals. High-speed signals are transmitted directly through protruding lines without passing through substrate lines, while low-speed signals continue to use the substrate lines. This segmentation eliminates the contradiction for high-speed signals by removing them from the problematic substrate line path.
Solution Approach 2:
The protruding lines act as an intermediary structure between the flexible printed circuit board and the semiconductor device. These lines provide a direct electrical connection path that bypasses the substrate lines, thereby reducing wiring resistance and signal attenuation for high-speed signals while maintaining the existing substrate line infrastructure for low-speed signals.
2Reliability
If all lines on the base material are electrically connected to bumps without passing through substrate lines, then signal attenuation is minimized, but the pitch between bumps must be long which increases the size of the semiconductor device
Solution Approach 1:
The patent applies local quality by providing different connection structures for different signals. Only the protruding lines that require high-speed signal transmission are connected directly to the bumps without passing through substrate lines. Other lines continue to use the substrate lines. This localized approach minimizes signal attenuation where needed while maintaining compact device size overall.
3Reliability
If complex impedance matching is performed for all signals, then signal transmission quality can be maintained, but the circuit design becomes complicated and difficult to implement
Solution Approach 1:
The patent segments the signal paths into two categories: high-speed signals that require direct connection through protruding lines (where impedance matching is simpler), and low-speed signals that can use the existing substrate lines. This segmentation reduces the overall circuit design complexity by minimizing the number of signals that require complex impedance matching procedures.
Data Source
AI summary
An electrooptical device includes a substrate that holds an electrooptical substance, a first substrate line and a second substrate line provided on the substrate, a semiconductor device provided on the substrate, a first input bump and a second input bump provided on a surface of the semiconductor device, the surface being close to the substrate, an output bump provided on the surface of the semiconductor device to be connected to the first substrate line, a base material mounted on the substrate, a first line provided on the base material to be electrically connected to the first input bump, and a second line provided on the base material to be electrically connected to the second input bump via the second substrate line.