Electrophoretic Display External Circuit Nesting

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Solution Overview

Problem

Existing electrophoretic display apparatuses face issues with surface flatness and structure reliability due to the protrusion of external circuits and the occurrence of bubbles during the encapsulating process, which affects the overall reliability of the display.

Innovation Solution

The electrophoretic display apparatus incorporates a flexible substrate with a display medium layer and a first optical adhesive layer, where the external circuit is positioned between the flexible substrate and the drive array substrate, ensuring the thickness of the external circuit is the sum of the display medium layer and the optical adhesive layer, thereby maintaining surface flatness and preventing bubble formation during encapsulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the external circuit is inserted between the display medium layer and the TFT array substrate, then the electrical connection is established, but the external circuit protrudes upwardly causing uneven surface phenomenon

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidsurface flatness

Core Design Contradiction:

ReliabilityVSShape

Solution Approach 1:

The external circuit is nested within the bonding region of the flexible substrate, which itself is nested between the drive array substrate and the electrophoretic display film. This multi-level nesting structure allows the external circuit to be electrically connected while remaining flush with the overall surface, eliminating protrusion.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The flexible substrate with bonding region provides a spatial dimension solution by extending the connection area in the planar direction rather than vertically. The external circuit is distributed across the bonding region area, allowing electrical connection without vertical protrusion that would affect surface flatness.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If the external circuit protrudes upwardly, then the electrical connection is established, but bubbles occur during the encapsulant filling process

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidbubble formation

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The external circuit is nested within the bonding region of the flexible substrate, eliminating protrusion that would create gaps during encapsulant filling. This nested configuration allows the encapsulant to flow smoothly without trapping bubbles, while maintaining electrical connection functionality.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Reliability

If the external circuit is inserted, then the electrical connection is established, but the overall structure reliability is affected

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidoverall structure reliability

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The external circuit is nested within the bonding region of the flexible substrate, which is itself nested between the drive array substrate and the electrophoretic display film. This nested configuration integrates the external circuit into the overall structure without creating protrusions or gaps, maintaining both electrical connection reliability and overall structural integrity.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The flexible substrate with bonding region extends the connection in the planar dimension rather than vertically, allowing the external circuit to be integrated flush with the surface. This dimensional approach maintains overall structural composition stability while enabling electrical connection.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the surface flatness and structural reliability of the electrophoretic display apparatus by eliminating the height difference that causes bubbles, resulting in a more reliable display structure.

Implementation Method 1

a first optical adhesive layer, wherein the first optical adhesive layer is disposed between the display medium layer and the drive array substrate

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS9268192B2Electrophoretic display apparatus

Publication Date: 2016.02.23 E INK HLDG INC

AI summary

An electrophoretic display apparatus is suitable for being electrically connected to an external circuit and includes a drive array substrate, an electrophoretic display film and a first optical adhesive layer. The electrophoretic display film is disposed on the drive array substrate and includes a flexible substrate and a display medium layer. The flexible substrate has a disposed region and a bonding region. The external circuit is disposed between the flexible substrate and the drive array substrate, located in the bonding region and extends outside the drive array substrate. The display medium layer is disposed between the flexible substrate and the drive array substrate and located in the disposed region. The first optical adhesive layer is disposed between the display medium layer and the drive array substrate. A thickness of the external circuit is substantially a sum of that of the display medium layer and the first optical adhesive layer.