Electroplated Copper Conductive Structures for Wireless Charging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for manufacturing conductive structures on substrates face challenges in improving manufacturing cost and efficiency, sustainability, and achieving high electrical conductivity while maintaining robustness, particularly in creating complex structures with limited material usage and avoiding hazardous waste.
Innovation Solution
A method involving the deposition of a conductive ink pattern on a substrate followed by electroplating copper to form a thick, conductive structure, which enhances conductivity without requiring high-temperature heat treatment, allowing for intricate designs and efficient use of materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional methods are used to manufacture conductive structures on substrates, then manufacturing processes are established, but manufacturing cost and efficiency are insufficient, and sustainability is compromised
Solution Approach 1:
The conductive ink pattern is printed and dried before electroplating, preparing the substrate with a conductive base layer in advance. This preliminary action enables the subsequent electroplating process to proceed efficiently with precise material deposition, improving both manufacturing efficiency and cost-effectiveness by avoiding waste and reducing rework.
2Reliability
If conventional conductive structures are used, then basic conductivity is achieved, but electrical conductivity levels are insufficient for high-performance applications
Solution Approach 1:
The invention combines conductive ink and electroplated copper to create a composite conductive structure. The conductive ink provides a flexible, patternable base layer, while the electroplated copper enhances electrical conductivity. This composite approach achieves bulk copper-like conductivity levels while using materials efficiently and sustainably.
Solution Approach 2:
The electroplating process changes the physical and electrical parameters of the conductive structure by depositing copper layers with controlled thickness and density. This parameter change transforms the conductive ink pattern into a high-conductivity composite structure suitable for demanding electrical applications.
3Adaptability or versatility
If complex conductive structures are created, then design flexibility is improved, but structural robustness during manufacture and end use is compromised
Solution Approach 1:
The conductive ink pattern is printed and dried to form a stable base structure before electroplating. This preliminary action creates a robust framework that maintains structural integrity during the electroplating process and in final application, even for complex geometries.
Solution Approach 2:
The combination of conductive ink and electroplated copper creates a composite structure where the ink provides flexibility and pattern complexity, while the copper plating adds structural robustness and electrical performance. This composite approach maintains strength in complex designs.
4Productivity
If traditional manufacturing methods are used, then conductive structures are produced, but hazardous waste is generated and sustainability is reduced
Solution Approach 1:
The invention extracts only the necessary copper material to deposit onto the conductive ink pattern through electroplating. This precise material application eliminates the need for excessive copper usage and hazardous chemical waste associated with traditional etching and plating methods, achieving sustainable manufacturing with high productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in conductive structures with conductivity levels approaching bulk copper, suitable for various applications, including wireless charging, while minimizing material waste and environmental impact.
Implementation Method 1
printing a thin layer of a conductive paste or ink on the substrate in a preselected pattern
Implementation Method 2
plating a layer of copper onto the conductive ink pattern to increase the conductance of the pattern
Implementation Method 3
the transmitter and receiver coils being configured to be inductively coupled
Data Source
AI summary
A conductive structure is fabricated on a substrate (either flexible or rigid) by first printing a precursor seed layer of a conductive ink, then electroplating a highly conductive metal such as Cu or Ag onto the precursor. The plated layer has a conductivity approaching that of the bulk metal. To improve the uniformity of plating, an intervening layer of electroless metal may be deposited onto the precursor prior to electroplating. The structure may be used for applications such as coils used in a wireless power transfer system.