Electroplated MLPC Terminal Structure for Thinner Capacitors
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Solution Overview
Problem
Traditional capacitors with lead frame bending structures face limitations in miniaturization due to occupied space, hindering the development of thinner, high-frequency, and reliable electronic components.
Innovation Solution
A substrate-type multi-layer polymer capacitor with an electroplated terminal structure, where the core is sealed within a casing using a curing adhesive and electroplated terminals are formed to maximize the design area and reduce impedance, allowing for thinner and more reliable capacitors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a traditional lead frame bending structure is used to form terminals, then the capacitor can be manufactured with conventional processes, but the bending space occupies volume and increases thickness, limiting miniaturization
Solution Approach 1:
The patent extracts the terminal formation process from the traditional lead frame bending structure and replaces it with electroplating directly on the capacitor electrodes. This removes the unnecessary lead frame component and its associated bending space, achieving thinner capacitors while maintaining manufacturability through the electroplating process.
Solution Approach 2:
The patent replaces the mechanical lead frame bending system with an electrochemical electroplating system. Instead of mechanically bending lead frames to form terminals, the invention uses electroplating to directly form conductive terminal structures on the capacitor electrodes, eliminating the mechanical bending space and reducing overall thickness.
2Volume of moving object
If the capacitor is thinned to meet miniaturization requirements, then the size is reduced, but the traditional lead frame bending structure becomes limited and cannot provide adequate terminal configuration
Solution Approach 1:
The electroplated terminal structure serves multiple functions: it provides electrical connection, forms protective sealing, and enables flexible terminal configurations in a compact space. This multi-functional approach replaces the specialized lead frame bending structure, providing adaptability for various terminal arrangements while maintaining thin profile.
Solution Approach 2:
The patent changes the fundamental parameter of terminal formation from mechanical bending to electrochemical deposition. This parameter change enables terminals to be formed directly on the capacitor body in various configurations without requiring the space-intensive bending process, providing flexibility in terminal arrangement while maintaining reduced thickness.
3Volume of moving object
If electroplated terminals are used instead of lead frame bending, then the capacitor thickness is reduced and design area is maximized, but the electroplating process must be precisely controlled
Solution Approach 1:
The electroplating process is designed to be self-regulating, where the electrical connection requirements and capacitor structure itself guide the plating deposition. The electroplating automatically conforms to the electrode geometry and electrical field distribution, reducing the need for external precision control while achieving consistent terminal formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The electroplated terminal structure enables thinner capacitors with improved electrical capacity and service life by maximizing the negative electrode area and reducing impedance, while also enhancing heat dissipation and shielding against moisture.
Implementation Method 1
the first electroplated terminal and the second electroplated terminal are formed by electroplating
Implementation Method 2
a curing adhesive is filled between a wall of the inner cavity of the casing and an outer surface of the core such that the core is sealedly fixed in the inner cavity of the casing
Data Source
AI summary
A substrate-type multi-layer polymer capacitor (MLPC), including a casing, a core, a first electroplated terminal and a second electroplated terminal. The core is arranged in an inner cavity of the casing. The casing is formed by joining two first packaging plates with two second packaging plates. The first and second electroplated terminals are formed by electroplating. The first electroplated terminal is configured to cover one end of the casing to form an anode electrically led out from the core, and the second electroplated terminal is configured to the other end of the casing to form a cathode electrically led out from the core. The first packaging plate includes a substrate, an electrode plate and two metal plates. The first and second electroplated terminals are integrally sealed with the casing.