Electroplated Layer on Polymeric Composite via Conductive Veil

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Solution Overview

Problem

Existing methods for applying metallic coatings to polymeric composite materials, such as electroplating, result in low bond strength, while alternative techniques like vapor deposition and thermal spraying offer higher bond strength but require high temperatures or aggressive surface preparation, making them unsuitable for all components, especially small or thin-walled ones.

Innovation Solution

A method involving an uncured polymeric composite substrate with a veil layer of metal-coated fibers consolidated by an organic binder, which is cured to partially expose the surface, allowing for electroplating with high bond strength without aggressive surface preparation, and optionally abrading to further enhance the bond strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If electroplating is applied directly to the composite substrate, then the process is simple and low cost, but the bond strength of the coating is low

Engineering Contradiction:

Improveprocess simplicityVSAvoidcoating bond strength

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

An electrically conductive veil layer is introduced as an intermediary between the composite substrate and the electroplated coating. This veil layer serves as a mediator that provides both electrical conductivity for electroplating and mechanical anchoring through partial embedding, resolving the contradiction between process simplicity and coating bond strength.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The solution uses a composite structure consisting of the original composite substrate, an electrically conductive veil layer, and the electroplated coating. This multi-layer composite material system combines the advantages of each layer to achieve both ease of manufacture and high bond strength.

Inventive Principle:

Principle #40Composite materials

2Strength

If vapour deposition techniques are used, then the coating bond strength is improved, but high processing temperatures damage the composite substrate material

Engineering Contradiction:

Improvecoating bond strengthVSAvoidsubstrate damage from high temperature

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent replaces thermal/vacuum deposition processes with wet electroplating chemistry. This substitution eliminates the need for high processing temperatures while maintaining coating bond strength through the mechanical embedding of the veil layer, resolving the contradiction between bond strength and substrate damage.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Strength

If thermal spraying is used, then the coating bond strength is improved, but abrasive grit blasting surface preparation causes mechanical degradation of the composite material

Engineering Contradiction:

Improvecoating bond strengthVSAvoidmechanical degradation from surface preparation

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The electrically conductive veil layer is applied to the composite substrate before the electroplating process. This preliminary action provides both the electrical conductivity needed for electroplating and the mechanical embedding structure for bond strength, eliminating the need for subsequent abrasive surface preparation and preventing mechanical degradation.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the application of metallic coatings with high bond strength, suitable for both decorative and abrasive applications, while being simpler, cost-effective, and suitable for components in mechanically arduous conditions.

Implementation Method 1

applying an electroplated layer to the partially exposed electrically conductive surface of the cured polymeric composite material

Methodology Applied

Scientific EffectElectroplating: Electroplating

Data Source

PatentUS10221704B2Method of applying an electroplated layer to a polymeric composite material

Publication Date: 2019.03.05 ROLLS ROYCE PLC

AI summary

A method of applying an electroplated layer to a surface of a polymeric composite material, the method includes the steps of: providing an uncured polymeric composite substrate; positioning a veil layer over a surface of the uncured polymeric composite substrate, the veil layer providing a conductive surface on the uncured polymeric composite substrate, the veil layer having a mat of metal coated fibres consolidated by an organic binder material; subjecting the uncured polymeric composite substrate to a curing cycle to form a cured polymeric composite material in which the veil layer is partially exposed; and applying an electroplated layer to the conductive surface of the cured polymeric composite material.