Electroplated Rhenium Superconducting Circuits
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Solution Overview
Problem
Current superconducting materials face challenges such as low critical temperatures, toxicity, oxidation, poor mechanical properties, and incompatibility with standard circuit fabrication techniques, limiting their integration into high-speed and quantum computing applications.
Innovation Solution
The development of a superconducting circuit system involving electroplated Rhenium (Re) layers with specific thickness and patterning, encapsulated to prevent oxidation, and integrated with compatible conductive layers to enhance critical temperature above 4.2 K, allowing for high critical current densities and low RF losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional superconducting materials (Nb, Nb-N, Nb-Ti) are used to achieve high critical temperature, then Tc is improved, but mechanical workability and soldering properties deteriorate due to strong oxidation
Solution Approach 1:
The patent uses composite material structures including Re-based superconducting layers combined with protective and adhesion layers (such as Ta, W, Mo, or their alloys) to create a multi-layer system that maintains high Tc while improving mechanical properties and oxidation resistance. The composite structure allows each layer to contribute its optimal properties to the overall device performance.
Solution Approach 2:
The patent employs inert or reducing atmosphere processing environments during fabrication and storage to prevent oxidation of the Re-based superconducting materials. This includes using vacuum or inert gas-filled chambers during deposition and handling processes to maintain material integrity and prevent formation of non-superconducting oxide layers.
2Ease of manufacture
If other typical materials (Pb, In, Sb, Al) are used to improve ease of manufacture, then compatibility with fabrication techniques is improved, but critical temperature and toxicity issues worsen
Solution Approach 1:
The patent changes the material parameters by using Rhenium and its alloys instead of traditional low-Tc materials like Pb, In, or Al. This parameter change achieves Tc above 4.2 K while maintaining compatibility with standard fabrication techniques through electroplating processes and appropriate thickness control (10 nm to 1000 nm).
3Reliability
If Re layer thickness is increased to improve superconducting properties, then critical current density is improved, but manufacturing complexity and oxidation risk increase
Solution Approach 1:
The patent optimizes the Re layer thickness parameter to a specific range (10 nm to 1000 nm) that achieves sufficient critical current density while minimizing oxidation risk and manufacturing complexity. This parameter optimization balances superconducting performance with practical fabrication considerations.
Solution Approach 2:
The patent applies preliminary protective measures by depositing adhesion layers (Ta, W, Mo) and encapsulation layers before and after the Re superconducting layer. These preliminary actions prevent oxidation during subsequent processing steps and simplify the overall manufacturing process by protecting the sensitive Re material throughout fabrication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach results in superconducting circuits with critical temperatures up to 6.5 K, improved mechanical properties, and compatibility with standard microelectronics, enabling efficient integration into high-speed and quantum computing applications.
Implementation Method 1
a second Re layer. The second Re layer can be bonded to the first layer via electroplating
Implementation Method 2
Enhanced superconducting transition temperature in electroplated Rhenium
Data Source
AI summary
This disclosure describes systems, methods, and apparatus for multilayer superconducting structures comprising electroplated Rhenium, where the Rhenium operates in a superconducting regime at or above 4.2 K, or above 1.8 K where specific temperatures and times of annealing have occurred. The structure can include at least a first conductive layer applied to a substrate, where the Rhenium layer is electroplated to the first layer. A third layer formed from the same or a different conductor as the first layer can be formed atop the Rhenium layer.