Electroplating Apparatus Cleaning Drying Hanger Shoulder

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Solution Overview

Problem

Existing electroplating apparatuses face issues with spattering of plating solution during agitation, leading to attachment of droplets on non-contact parts such as the hanger shoulder and holder contact, which complicates cleaning and can affect plating quality.

Innovation Solution

Incorporation of a cleaning/drying part on the electroplating apparatus, specifically designed to clean and dry the hanger shoulder, holder contact, and plating bath contacts without removing the substrate holder, utilizing a cleaning liquid supplying device and gas discharge/suction system to efficiently remove droplets and dry the components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a paddle and/or circulation pump is used to agitate the plating solution, then uniformity of the plating solution is maintained, but spattering of the plating solution occurs which attaches to non-contact portions

Engineering Contradiction:

Improveuniformity of plating solutionVSAvoidspattering of plating solution

Core Design Contradiction:

Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The invention uses the harmful spattered plating solution droplets as a cleaning mechanism. The droplets that scatter during agitation naturally fall onto and clean the hanger shoulder and holder contact surfaces, converting the harmful spattering effect into a beneficial cleaning function that removes contaminants from these surfaces.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Manufacturing precision

If cleaning is performed on the hanger shoulder and holder contact, then plating quality is improved, but cleaning complexity increases for portions not originally in contact with plating solution

Engineering Contradiction:

Improveplating qualityVSAvoidcleaning system complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The system performs self-cleaning by utilizing the spattered plating solution droplets to automatically clean the hanger shoulder and holder contact surfaces. This eliminates the need for separate cleaning mechanisms or manual intervention, as the harmful spattering effect becomes the cleaning agent itself.

Inventive Principle:

Principle #25Self-service

3Ease of operation

If the substrate holder is removed for cleaning, then cleaning access is improved, but throughput is reduced

Engineering Contradiction:

Improvecleaning accessVSAvoidthroughput

Core Design Contradiction:

Ease of operationVSProductivity

Solution Approach 1:

The cleaning function is integrated into the normal operation cycle. The spattered droplets continuously clean the hanger shoulder and holder contact surfaces during and after plating operations, eliminating the need to stop production or remove the substrate holder for separate cleaning operations.

Inventive Principle:

Principle #25Self-service

4Loss of substance

If metal is deposited on the substrate holder, then plating solution utilization is efficient, but plating quality is influenced negatively

Engineering Contradiction:

Improvemetal deposition efficiencyVSAvoidplating quality

Core Design Contradiction:

Loss of substanceVSManufacturing precision

Solution Approach 1:

The invention extracts and removes the deposited metal from the hanger shoulder and holder contact surfaces using the spattered plating solution droplets. By continuously cleaning these surfaces, the system prevents metal accumulation that would otherwise interfere with electrical contact and degrade plating quality.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables effective cleaning and drying of critical components within the electroplating apparatus without reducing throughput, maintaining stable plating conditions and improving the efficiency of the cleaning process.

Implementation Method 1

The agitation of the plating solution by means of the paddle and/or the circulation pump may result in spattering (scattering) of the plating solution

Methodology Applied

Scientific EffectSpattering:

Implementation Method 2

In a method called an electroplating method, a substrate is immersed in a plating solution, and electric and chemical reactions are caused on the surface of the substrate to thereby plate metal in the plating solution on the substrate

Methodology Applied

Scientific EffectElectroplating: Electroplating

Implementation Method 3

If such a substrate holder is used, the metal in the plating solution may be deposited on a part of the substrate holder that is immersed in the plating solution

Methodology Applied

Scientific EffectElectrodeposition: Electrodeposition

Data Source

PatentUS11492721B2Electroplating apparatus and cleaning method in electroplating apparatus

Publication Date: 2022.11.08 EBARA CORP

AI summary

The agitation of the plating solution may result in spattering of the plating solution. It have been found that the spattered plating solution can be attached even to portions that are not originally brought into contact with the plating solution in the plating apparatus. There is provided an electroplating apparatus for plating a substrate using a substrate holder, the electroplating apparatus comprising at least one bath for storing the substrate, the substrate holder being provided with a hanger shoulder, and a holder contact, and wherein the electroplating apparatus being provided with a cleaning/drying part provided on at least one side of the bath, the cleaning/drying part being provided for cleaning and/or drying at least one of the hanger shoulder, the holder contact and a contact provided to the bath.