Electroplating Device Dual Cover Inert Gas Sealing
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Solution Overview
Problem
The stability of electroplating solutions in process chambers is compromised due to oxidation, particularly when not in use or during transitions, leading to unstable technological parameters and shorter service life.
Innovation Solution
An electroplating device with a process chamber, substrate holding device, and cover bodies that create a closed environment, using inert gas to prevent oxidation by maintaining a uniform positive pressure within the chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the process chamber remains open for substrate loading and unloading, then ease of operation is improved, but the electroplating solution is exposed to air and undergoes oxidation, compromising solution stability and service life
Solution Approach 1:
The patent applies inert atmosphere by introducing nitrogen gas into the process chamber to displace air and create an oxygen-free environment. The gas supply part delivers nitrogen through multiple inlet channels positioned at different heights, ensuring complete air displacement. This prevents oxidation of the electroplating solution while maintaining operational accessibility, as the chamber can be opened for substrate loading/unloading without continuous exposure to oxidizing conditions.
Solution Approach 2:
The patent implements preliminary action by filling the process chamber with inert nitrogen gas before substrate loading or unloading operations. The system proactively establishes a protective atmosphere in advance, so that when the chamber is opened for operations, the solution is already protected from oxidation. This preemptive measure ensures solution stability is maintained throughout the operational cycle.
2Reliability
If the process chamber is continuously closed to protect the electroplating solution, then solution stability is improved, but substrate loading and unloading operations become more complex
Solution Approach 1:
The patent applies dynamics by implementing a dynamic sealing system that adapts to operational needs. The cover body includes movable sealing structures that can open to accommodate substrate loading/unloading and then automatically close and seal. This dynamic mechanism allows the chamber to transition between open and closed states, maintaining solution stability when closed while enabling easy operations when open, without requiring continuous closure.
3Object-affected harmful factors
If air is continuously discharged from the process chamber to maintain inert atmosphere, then oxidation prevention is improved, but energy consumption increases
Solution Approach 1:
The patent implements periodic action by operating the exhaust system intermittently rather than continuously. The exhaust part activates periodically to remove accumulated air or excess nitrogen, and then remains inactive during periods when the inert atmosphere is already established. This periodic operation maintains effective oxidation prevention while significantly reducing energy consumption compared to continuous exhaust operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents oxidation of the electroplating solution, maintaining its stability, prolonging its service life, reducing costs, and simplifying production and management processes.
Implementation Method 1
a gas supply part, introducing an inert gas into the inner chamber
Implementation Method 2
maintaining a uniform positive pressure within the chamber
Implementation Method 3
an exhaust part, discharging air from the inner chamber
Implementation Method 4
a first cover body, connected to the substrate holding device to close the opening after the substrate holding device is moved into the inner chamber so that the inner chamber is in a closed state; a second cover body, closing the opening after the substrate holding device is moved out of the inner chamber so that the inner chamber is in a closed state
Data Source
AI summary
An electroplating device includes a process chamber, a substrate holding device, a first cover body, a second cover body, a gas supply part and an exhaust part. The electroplating solution is contained in the inner chamber of the process chamber and the inner chamber has an opening. The substrate holding device is used for holding a substrate, and the substrate holding device is moved into or out of the inner chamber through the opening. The first cover body is connected to the substrate holding device to close the opening after the substrate holding device is moved into the inner chamber, so that the inner chamber is in a closed state. The second cover body is used for closing the opening after the substrate holding device is moved out of the inner chamber, so that the inner chamber is in the closed state again.