Electroplating Composition Dual Leveling Agents High Aspect Ratio
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Solution Overview
Problem
Conventional electroplating compositions with leveling agents face limitations in achieving smoothness, particularly in features with high aspect ratios, leading to defects like overplating and surface irregularities during semiconductor device manufacturing.
Innovation Solution
An electroplating composition comprising a combination of two different leveling agents, each represented by a specific compound structure, is used to enhance surface smoothness by improving the polarization effect during the electroplating process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional leveling agents (polyethyleneimine, polyglycine, polyurea, polyacrylamide, polyaminoamide, polyalkanolamine, polyvinylpyridine, polyvinylpyrrolidone, copolymers of vinylimidazole and vinylpyrrolidone) are used in electroplating composition, then surface smoothness is improved to some extent, but the smoothness is still insufficient and defects like overplating and surface irregularities occur in features with high aspect ratios
Solution Approach 1:
The patent changes the chemical structure parameters of the leveling agent by introducing a specific heterocyclic ring structure with nitrogen, oxygen, sulfur, selenium, or silicon atoms. This structural modification enables the leveling agent to effectively control plating uniformity in high aspect ratio features, resolving the insufficiency of conventional leveling agents in achieving both smoothness and defect-free surfaces
Solution Approach 2:
The patent creates a composite electroplating composition that includes the novel heterocyclic leveling agent combined with conventional electroplating components (metal salts, acids, additives). This composite formulation achieves synergistic effects that simultaneously improve surface smoothness and prevent defects like overplating and surface irregularities in high aspect ratio features
2Productivity
If accelerators are included in the electroplating composition to charge features with high aspect ratios, then plating speed is improved, but bumps are formed and overplating occurs leading to surface irregularities
Solution Approach 1:
The heterocyclic leveling agent provides local quality control by selectively adsorbing to high aspect ratio features and regulating metal ion deposition in those specific regions. This localized action prevents overplating and bump formation in high aspect ratio areas while maintaining the accelerated plating speed provided by accelerator additives in the bulk solution
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of two distinct leveling agents in the electroplating composition significantly improves the smoothness of the plated surface, reducing defects and ensuring even plating, especially in features with high aspect ratios, thereby enhancing the reliability of semiconductor devices.
Implementation Method 1
The features are charged by electroplating with an electroplating composition
Implementation Method 2
The features are charged by electroplating with an electroplating composition
Implementation Method 3
improving the polarization effect during the electroplating process
Data Source
AI summary
The present invention relates to a electroplating composition and an electroplating method using the same. The electroplating composition of the present invention comprising a first leveling agent and a second leveling agent, wherein the first leveling agent and the second leveling agent each, independently, comprise a compound represented by Chemical Formula 1 below: