Electroplating Electrolyte Control for Acid-Metal Ion Drift

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Solution Overview

Problem

The acid/metal ion partition effect in electroplating solutions leads to undesirable concentration fluctuations, affecting electroplating performance, and existing methods to control these fluctuations are either costly or complex, such as high electrolyte replenish rates or complicated dosing algorithms.

Innovation Solution

A method and system that utilize a secondary electroplating solution with concentrations significantly different from the primary solution to correct concentration drifts, reducing the need for frequent replenishment and simplifying the dosing process by introducing the secondary solution only when necessary, thereby maintaining target concentrations with reduced operational costs and complexity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If high electrolyte replenish rates are used to control concentration fluctuations, then electroplating performance is improved, but operational costs increase

Engineering Contradiction:

Improveelectroplating performanceVSAvoidoperational costs

Core Design Contradiction:

ReliabilityVSLoss of substance

Solution Approach 1:

The patent changes the concentration parameter of the electrolyte by introducing a secondary electrolyte with significantly different concentration characteristics. This secondary electrolyte is specifically designed to counteract the acid/metal ion partition effect, thereby controlling concentration fluctuations without requiring high replenish rates of the primary electrolyte, thus reducing operational costs while maintaining performance

Inventive Principle:

Principle #35Parameter changes

2Reliability

If complicated dosing algorithms are used to control concentration fluctuations, then electroplating performance is improved, but device complexity increases

Engineering Contradiction:

Improveelectroplating performanceVSAvoiddosing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent introduces a secondary electrolyte as an intermediary substance that simplifies the dosing process. Instead of using complicated algorithms to control primary electrolyte dosing, the secondary electrolyte naturally counteracts concentration drift through its unique composition, thereby reducing dosing complexity while maintaining electroplating performance

Inventive Principle:

Principle #24Intermediary (Mediator)

3Stability of the object's composition

If frequent electrolyte replenishment is conducted to maintain target concentrations, then concentration stability is improved, but productivity decreases

Engineering Contradiction:

Improveconcentration stabilityVSAvoidsubstrate processing throughput

Core Design Contradiction:

Stability of the object's compositionVSProductivity

Solution Approach 1:

The patent implements periodic action by conducting dosing of the secondary electrolyte only when concentration drift exceeds predetermined thresholds, rather than continuous replenishment. This threshold-based periodic dosing maintains concentration stability within acceptable ranges while minimizing interruptions to substrate processing, thus preserving productivity

Inventive Principle:

Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively stabilizes electroplating solution concentrations, improving electroplating performance by minimizing concentration drifts and reducing operational costs through efficient use of secondary electrolytes, which are used sparingly to maintain optimal metal ion and acid levels.

Implementation Method 1

Electrochemical deposition process is widely used in the semiconductor industry for metallization of integrated circuit manufacturing

Methodology Applied

Scientific EffectElectrochemical deposition: Electrodeposition

Implementation Method 2

the copper cation is reduced electrochemically to copper metal

Methodology Applied

Scientific EffectElectrochemical reduction: Redox Reactions

Implementation Method 3

The acid/metal ion partition effect in electroplating solutions leads to undesirable concentration fluctuations

Methodology Applied

Scientific EffectAcid/metal ion partition effect:

Data Source

PatentUS11859300B2Controlling plating electrolyte concentration on an electrochemical plating apparatus

Publication Date: 2024.01.02 LAM RES CORP

AI summary

Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.