Electroplating Fixture for Transfer Mold Gate Coating
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Solution Overview
Problem
Conventional electroplating apparatuses are unable to effectively coat the inside gate wall of transfer molds used in semiconductor device encapsulation due to the conical configuration and depth, leading to uneven electric fields and potential damage during the electroplating process.
Innovation Solution
A fixture with a through-hole that secures an electrode in a slide-fit configuration, ensuring precise alignment and preventing direct contact with the transfer mold gate, combined with air-release slots to reduce gas buildup and maintain alignment, allowing for effective electroplating of the inside gate wall.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional electroplating apparatus is used, then the electroplating process can be performed, but the electric field is stronger at the outer surface and weaker at the inside gate wall due to the conical configuration and depth, making effective coating impossible
Solution Approach 1:
The patent introduces a novel fixture design with a through-hole configuration that allows the electrode to be positioned in a different spatial dimension, enabling it to reach inside the conical gate wall structure. This dimensional change allows the electrode to be placed closer to the inside gate wall surface, thereby strengthening the electric field in that region and achieving uniform coating deposition.
2Manufacturing precision
If the electrode is introduced directly into the space adjacent to the inside gate wall, then electroplating can be performed, but direct mutual contact between the electrode and the inner gate wall may occur, causing damage
Solution Approach 1:
The patent introduces a fixture as an intermediary component between the electrode and the transfer mold gate. The fixture holds the electrode at a controlled distance from the inside gate wall, preventing direct contact while still allowing the electric field to effectively reach the coating surface. This intermediary structure eliminates the risk of mechanical damage during the electroplating process.
Solution Approach 2:
The through-hole in the fixture creates a new spatial dimension for electrode positioning, allowing precise alignment and controlled spacing. This dimensional approach ensures the electrode maintains optimal distance from the gate wall surface, achieving both accurate alignment and damage prevention simultaneously.
3Measurement precision
If the through-hole depth is increased to improve electrode guidance, then alignment precision is improved, but the complexity of the fixture increases
Solution Approach 1:
The patent applies local quality by providing guidance features only where needed - specifically within the through-hole region where electrode positioning is critical. The fixture structure remains simple elsewhere, maintaining overall simplicity while achieving precise alignment locally through the strategically designed through-hole depth and configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures precise alignment and reduces the risk of damaging the transfer mold gate during electroplating, enabling efficient and accurate deposition of metal layers on the inside gate wall, thereby improving the encapsulation process.
Implementation Method 1
an apparatus for electroplating an inside wall of a transfer mold
Data Source
AI summary
An apparatus is disclosed for electroplating an inside wall of a transfer mold, the transfer mold being suitable for use in semiconductor device encapsulation. Specifically, the apparatus comprises a fixture, as well as a through-hole in the fixture for receiving an electrode to electroplate the inside wall of the transfer mold. In particular, the through-hole is configured to receive the electrode in a slide-fit to form a mutual interference fit for securing the electrode to the fixture. Upon fitting the electrode into the through-hole, the apparatus can then be used to electroplate the inside wall of the transfer mold by introducing the electrode into the space adjacent to the inside wall of the transfer mold. A device for use as an electrode in the apparatus is also disclosed.