Electroplating Processor Geometric Flow Path Bubble Removal
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Solution Overview
Problem
Existing electroplating processors face challenges in achieving consistent plating results due to bubbles in the plating liquid collecting and sticking to the membrane, disrupting the electric field and leading to inconsistent plating.
Innovation Solution
An electroplating processor with a continuous flow path, either coiled or straight, is designed to prevent bubbles from sticking to the membrane by maintaining high electrolyte velocity, ensuring bubbles are entrained and carried away, and an alternative design using a tubular membrane with a metal electrode inside to enhance bubble removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a membrane is used to separate anolyte from catholyte in traditional electroplating processors, then the plating liquid can be divided into functional zones, but bubbles collect and stick to the bottom surface membrane disrupting the electric field and leading to inconsistent plating results
Solution Approach 1:
The patent applies the dynamics principle by transforming the static membrane configuration into a dynamic flow system. The S-shaped flow channel design creates continuous electrolyte movement through the membrane structure, preventing bubbles from settling and adhering to the membrane surface. The flow velocity and directional changes in the S-shaped channel actively dislodge and transport bubbles away from the membrane, converting a static bubble-trapping problem into a dynamic bubble-removal system.
Solution Approach 2:
The patent applies the curvature principle through the S-shaped flow channel design. The curved, serpentine path of the flow channel creates multiple directional changes and centrifugal forces that prevent bubbles from adhering to the membrane surface. The curved geometry promotes turbulent flow patterns and ensures that bubbles are continuously redirected and carried away from the membrane by the flowing electrolyte, rather than allowing them to accumulate in straight-line flow paths.
2Reliability
If high electrolyte velocity is maintained through the flow path, then bubbles are prevented from sticking to the membrane and are carried away, but the energy consumption increases
Solution Approach 1:
The S-shaped curved channel design optimizes flow dynamics to maintain high velocity with reduced energy input. The curved geometry creates natural flow acceleration zones and prevents dead spots where energy would be wasted. The serpentine path distributes the energy input more efficiently throughout the flow channel length, maintaining sufficient velocity for bubble removal without requiring excessive pumping power compared to straight-channel designs.
Solution Approach 2:
The flow channel design incorporates preliminary action by pre-positioning flow acceleration zones and directional changes that naturally promote bubble detachment before bubbles can adhere to the membrane. The S-shaped channel geometry is designed to create flow conditions that actively remove bubbles in advance, preventing their accumulation and the need for additional energy-intensive bubble removal mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures consistent and reliable electroplating by preventing bubble accumulation, maintaining a stable electric field, and improving plating uniformity by ensuring high electrolyte velocity and efficient bubble removal.
Implementation Method 1
Any bubbles in the flow path are entrained in the fast moving electrolyte and carried away from the membrane
Implementation Method 2
an electroplating processor applies one or more layers of conductive materials, typically a metals, onto the substrate
Data Source
AI summary
An electroplating processor includes an electrode plate having a continuous flow path formed in a channel. The flow path may optionally be a coiled flow path. One or more electrodes are positioned in the channel. A membrane plate is attached to the electrode plate with a membrane in between them. Electrolyte moves through the flow path at a high velocity, preventing bubbles from sticking to the bottom surface of membrane. Any bubbles in the flow path are entrained in the fast moving electrolyte and carried away from the membrane. The electroplating processor may alternatively have a wire electrode extending through a tubular membrane formed into a coil or other shape, optionally including shapes having straight segments.