Electroplating Jet Array for High Mass-Transfer
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Solution Overview
Problem
Conventional electroplating systems face challenges in achieving uniformity of the plated film across semiconductor wafers, particularly due to irregularities in the electric field, mass-transfer rates, and deep trench features, which can lead to co-planarity issues and limited deposition rates.
Innovation Solution
The introduction of a submerged spray jet array within the electroplating vessel, which sprays pressurized jets of electrolyte against the wafer, significantly increases the strain rate and mass transfer rate, enabling higher deposition rates and improved co-planarity, especially in deep trench features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional electroplating methods are used, then the process is simpler to implement, but the mass transfer rate is insufficient leading to limited deposition rates and poor co-planarity
Solution Approach 1:
The patent employs a spray jet array that delivers pressurized electrolyte directly to the wafer surface through multiple small orifices. This hydraulic approach creates high-velocity jets that dramatically enhance mass transfer of metal ions to the substrate, enabling deposition rates approximately an order of magnitude higher than conventional electroplating while maintaining system complexity at a manageable level through the use of standard pump and spray component technology
2Manufacturing precision
If conventional electroplating is used, then the system is easier to operate, but uniformity of plated film across the wafer is poor due to irregularities in mass transfer rates
Solution Approach 1:
The electrolyte delivery system is segmented into multiple discrete spray jets distributed across the wafer surface. Each jet independently delivers electrolyte to a specific region, ensuring uniform mass transfer rates across the entire substrate. This segmented approach compensates for variations in wafer geometry and electric field distribution, achieving consistent plated film uniformity while maintaining straightforward operational procedures
Solution Approach 2:
The spray jet array provides locally optimized electrolyte delivery by positioning multiple jets at specific locations across the wafer surface. Each jet is tailored to deliver appropriate electrolyte flow to its corresponding region, accounting for local variations in current density and mass transfer requirements. This local quality approach ensures uniform deposition across the entire wafer while keeping the overall system easy to operate
3Manufacturing precision
If conventional electroplating methods are used, then the equipment is less complex, but co-planarity in deep trench features is poor
Solution Approach 1:
High-velocity pressurized spray jets are directed into deep trench features to forcibly deliver electrolyte to the bottom surfaces and sidewalls. The hydraulic pressure overcomes the difficulty of reaching into deep geometries, ensuring uniform mass transfer and co-planar deposition even in challenging deep trench structures, while the spray jet array itself remains a relatively simple component configuration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the mass transfer rate by approximately an order of magnitude, allowing for higher deposition rates and improved co-planarity across semiconductor wafers, while also reducing the complexity and cost associated with conventional methods.
Implementation Method 1
sprays pressurized jets of electrolyte against the wafer
Implementation Method 2
significantly increases the strain rate and mass transfer rate
Implementation Method 3
electric current is conducted through an electrolyte to the wafer, to deposit a blanket layer or patterned layer of a metal or other conductive material onto the seed layer
Implementation Method 4
electric current is conducted through an electrolyte to the wafer, to deposit
Data Source
AI summary
Exemplary electroplating systems may include a vessel. The systems may include a head that is configured to hold a substrate. The head may be positionable within an interior of the vessel. The systems may include a spray jet array disposed within the interior of the vessel. The spray jet array may include a plate defining a plurality of apertures through a thickness of the plate. The systems may include at least one fluid pump that is fluidly coupled with an inlet end of each of the plurality of apertures.