Laminated Electronic Component Electroplating External Electrodes
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Solution Overview
Problem
Existing methods for forming external electrodes in laminated electronic components, such as multilayer ceramic capacitors, face challenges including complex processes, low effective volume rates, and degraded humidity resistance due to the use of conductive pastes and electroless plating, which result in inefficient electrical connections and plating uniformity issues.
Innovation Solution
A method involving electroplating directly onto exposed internal electrodes to form dense plating layers without the need for conductive paste layers or catalysts, with controlled electrode spacing and protrusion, using a rotating container in a plating solution with specific pH and brightening agents to enhance deposition and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If paste electrode layers are used to form external electrodes, then electrical connection is ensured, but the effective volume rate decreases due to the large thickness of the paste electrode layers
Solution Approach 1:
The patent changes the fundamental parameter of electrode formation from paste-based to electroplating-based. By controlling the plating thickness to several micrometers instead of tens to hundreds of micrometers, the effective volume rate increases while electrical connection reliability is maintained through the conductive nature of the electroplated metal layers
Solution Approach 2:
The patent extracts and eliminates the paste electrode layer from the external electrode structure, retaining only the electroplating layers. This removes the volume-consuming paste material while preserving the essential electrical connection function through the metal plating layers directly formed on the internal electrodes
2Ease of manufacture
If electroless plating is used to form external electrodes, then the plating process is simplified, but the plating uniformity and density deteriorate
Solution Approach 1:
The patent replaces the chemical-based electroless plating system with an electroplating system that uses electrical current for metal deposition. This substitution enables better control over plating uniformity and density through electrical parameter control (current density, plating time) while achieving the desired manufacturing simplicity
Solution Approach 2:
The patent changes the plating method from electroless to electroplating, introducing electrical parameters (current density, voltage, plating time) as control variables. This enables precise control over plating thickness and uniformity, achieving dense and consistent electroplating layers on the internal electrodes
3Reliability
If conductive paste is applied to ensure electrical connection before plating, then the plating process can proceed, but the manufacturing complexity increases
Solution Approach 1:
The patent extracts and removes the conductive paste application step from the manufacturing process. By directly electroplating the internal electrodes, it eliminates the intermediate paste layer and the associated application, drying, and firing steps, thereby simplifying the overall manufacturing process while maintaining electrical connection
Solution Approach 2:
The patent ensures the internal electrodes are properly exposed and positioned before the electroplating process begins. This preliminary preparation of the substrate surface allows the electroplating to proceed directly without requiring additional conductive paste layers, simplifying the process while ensuring good electrical connection from the start
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a laminated electronic component with a high effective volume rate and superior humidity resistance, as the electroplating method allows for efficient and uniform formation of external electrodes, improving electrical connections and reducing the complexity of the manufacturing process.
Implementation Method 1
a method involving electroplating directly onto exposed internal electrodes to form dense plating layers
Data Source
AI summary
A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 μm or less when a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 μm or less, and is about 20 μm or less when a protruding length of the adjacent internal electrodes from the end surface is at least about 0.1 μm. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other.