Electroplating Metal Posts in Circuit Board Penetrating Holes

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional electroplating methods for circuit boards are inefficient and costly due to difficulties in forming slots for longer metal posts, which increases manufacturing costs and reduces production efficiency.

Innovation Solution

An electroplating method for circuit boards involving a multi-layer board with conductive and circuit layers, where thru-holes and penetrating holes are formed to allow for direct electroplating of metal posts, with the penetrating holes being circular and located on one side of the thru-holes, enabling efficient filling with metal posts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If conventional electroplating method is used to form longer metal posts, then the metal post length requirement is met, but the manufacturing cost increases and production efficiency decreases

Engineering Contradiction:

Improvemetal post lengthVSAvoidmanufacturing cost

Core Design Contradiction:

Length of moving objectVSEase of manufacture

Solution Approach 1:

The invention divides the metal post formation process into two parts: a first metal post formed by conventional electroplating through slots, and a second metal post formed by direct electroplating through circular penetrating holes. This segmentation allows different formation methods to be applied to different portions of the overall metal post structure, combining the advantages of both approaches.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Instead of forming slots first and then electroplating (conventional method), the invention inverts the approach by directly forming circular penetrating holes and electroplating metal posts within them. This reversal eliminates the need for difficult slot formation while achieving the same metal post length requirement.

Inventive Principle:

Principle #13The other way round (Inversion)

2Length of moving object

If conventional electroplating method with slots is used, then longer metal posts can be formed, but the slot formation is difficult and increases manufacturing complexity

Engineering Contradiction:

Improvemetal post lengthVSAvoidslot formation complexity

Core Design Contradiction:

Length of moving objectVSDevice complexity

Solution Approach 1:

The invention replaces the complex slot formation process with simpler circular penetrating hole formation. By inverting the conventional approach and using direct electroplating through circular holes, the manufacturing complexity is significantly reduced while maintaining the capability to form long metal posts.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The invention changes the geometric parameters of the hole structure from slot-shaped to circular cross-section. This parameter change simplifies the formation process, as circular holes can be more easily drilled and electroplated compared to slots, while still achieving the required metal post length through multi-layer board construction.

Inventive Principle:

Principle #35Parameter changes

3Length of moving object

If conventional electroplating method is used, then longer metal posts are achieved, but production efficiency is reduced

Engineering Contradiction:

Improvemetal post lengthVSAvoidproduction efficiency

Core Design Contradiction:

Length of moving objectVSProductivity

Solution Approach 1:

By inverting the conventional slot-based electroplating approach to direct circular hole electroplating, the invention streamlines the manufacturing process. This reversal eliminates time-consuming slot formation steps and enables more efficient metal post production while maintaining the required post length.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The invention performs preliminary actions by pre-forming circular penetrating holes through the multi-layer board before electroplating. This preliminary hole formation simplifies the subsequent electroplating process and increases overall production efficiency compared to forming slots in-situ during the electroplating process.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for direct formation of circular penetrating holes, increasing production efficiency and reducing manufacturing costs by enabling the electroplating of metal posts that fill the holes completely.

Implementation Method 1

electroplating the electroplated regions to form a metal post by applying a current to the conductive portion

Methodology Applied

Scientific EffectElectroplating: Electroplating

Data Source

PatentUS11129283B2Method of electroplating a circuit board

Publication Date: 2021.09.21 BOARDTEK ELECTRONICS CORP

AI summary

An electroplating method of a circuit board includes: providing a multi-layer board having a conductive layer embedded therein; penetratingly forming a thru-hole and at least one penetrating hole in the multi-layer board, and forming a conductive portion on an inner wall defining the thru-hole and connected to the conductive layer, wherein the at least one penetrating hole is located at one side of the thru-hole, and an annular portion of the conductive layer exposed from the at least one penetrating hole is defined as an electroplated region; and electroplating the electroplated region to be formed with a metal post by applying a current to the conductive portion, wherein the metal post is filled in the at least one penetrating hole and is connected to the electroplated region.