Electroplating Device with Movable Anode and Suction Channels
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Solution Overview
Problem
Existing electroplating technologies face challenges in achieving uniform copper plating on microstructures and large-scale production panels, particularly in ensuring efficient electrolyte distribution and adjustment across individually designed substrates.
Innovation Solution
An electroplating device with an electrolyte channel and an electroplating assembly featuring a movable anode with suction channels and a diffuser, combined with an oscillation frame for uniform electrolyte jetting and absorption, allowing adjustable plating distances and frequencies to enhance uniformity and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If large-scale chemical reaction cells with full-surface extraction devices are used, then sufficient electrolyte exchange efficiency is achieved for microstructures, but uniformity of electrolyte distribution and independent adjustment capability across the production panel cannot be achieved
Solution Approach 1:
The patent divides the production panel into multiple independently controllable regions, each with its own electroplating assembly. This segmentation allows each region to be adjusted independently while maintaining overall uniformity across the entire panel, resolving the contradiction between distribution uniformity and adjustment capability.
Solution Approach 2:
The patent introduces movable electroplating assemblies that can dynamically adjust their positions and orientations. This dynamic capability enables independent adjustment for different substrate designs while maintaining uniform electrolyte distribution through real-time positioning control.
2Adaptability or versatility
If electroplating assemblies are fixed on the electrolyte channel, then structural simplicity is maintained, but flexibility to adjust plating distance and adapt to different substrates is limited
Solution Approach 1:
The electroplating assembly is designed with movable components including the anode and cathode that can adjust their relative positions. This dynamic structure enables flexible plating distance adjustment for different substrate requirements while maintaining a relatively simple overall device architecture.
Solution Approach 2:
The patent extracts the adjustment mechanism from the fixed structure, allowing the electroplating assembly to be independently positioned and oriented. This separation of adjustment functionality from the main structure provides flexibility without significantly increasing overall device complexity.
3Manufacturing precision
If multiple suction channels are provided in the anode, then electrolyte absorption uniformity is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The anode is divided into multiple suction channels that are independently controllable. This segmentation improves electrolyte absorption uniformity by creating multiple localized flow zones, while the modular design actually simplifies manufacturing compared to a single complex channel system.
Solution Approach 2:
The patent uses hydraulic principles to control the suction channels, allowing uniform electrolyte absorption through fluid pressure control. This approach achieves precise absorption uniformity while maintaining relatively simple manufacturing through standard hydraulic component integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures uniform copper plating on production panels, improving plating quality and flexibility to meet various industrial requirements by optimizing electrolyte distribution and absorption, thereby enhancing electroplating efficiency and adaptability.
Implementation Method 1
an electrolyte channel for jetting an electrolyte toward the production panel
Implementation Method 2
a suction channel provided in the anode which is used for absorbing the electrolyte in a direction opposite to a jet-plating direction
Implementation Method 3
an electroplating unit for electroplating a production panel
Implementation Method 4
efficient electroplating on microstructures
Data Source
AI summary
An electroplating device and an electroplating method, the electroplating device includes an electroplating unit for electroplating a production panel. The electroplating unit includes an electrolyte channel for jetting an electrolyte toward the production panel, and an electroplating assembly disposed on an outer surface of the electrolyte channel. The electroplating assembly includes an anode disposed on the outer surface of the electrolyte channel, and a suction channel in the anode which is used for absorbing the electrolyte in a direction opposite to a jet-plating direction. The electrolyte may be uniformly distributed on the production panel by the combination of the electrolyte channel and the electroplating assembly.