Electroplating Nozzle Flow Parallel to Power Line
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Solution Overview
Problem
Traditional electroplating systems face inefficiencies in coating complex structures due to limited liquid flow impact on anodes and uneven solution distribution, leading to poor electroplating quality, especially on areas like sides, holes, and cavities, resulting in issues like fogging, burning, and uneven coating thickness.
Innovation Solution
An electroplating device with a liquid spraying system that directs the electroplating solution flow parallel to the power line formed by the anode and cathode, using nozzles to ensure effective solution distribution and impact on the workpiece, including multiple angled jets to cover complex areas, and a pump system to recycle and filter the solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the electroplating solution flows from bottom to top perpendicular to the electric field power line, then the liquid level can be controlled and simple selective electroplating can be completed, but the liquid flow impact force on the anode surface is weak and the electroplating effect on complex structures is limited
Solution Approach 1:
The anode is divided into multiple independent anode groups, each capable of being independently controlled. This segmentation allows different regions of the anode to serve different functions: some regions provide electroplating solution flow while others provide strong liquid flow impact on the cathode surface, resolving the contradiction between ease of operation and manufacturing precision.
Solution Approach 2:
The invention introduces a new dimension of liquid flow direction by directing the electroplating solution to flow substantially parallel to the electric field power line (from anode to cathode) rather than perpendicular to it. This dimensional change in flow direction enables strong liquid flow impact on the cathode surface while maintaining liquid level control capabilities.
2Ease of operation
If the electroplating solution flow direction is perpendicular to the electric field power line, then the liquid level in the overflow tank can be controlled, but the electroplating solution has insufficient impact on the electroplated functional surface causing fog, burning, and uneven coating thickness
Solution Approach 1:
The invention makes the liquid flow direction dynamic and adjustable by introducing a controllable flow direction adjustment mechanism. The electroplating solution flow direction can be adjusted to be substantially parallel to the electric field power line, creating strong liquid flow impact on the cathode surface while maintaining the ability to control liquid level, thus resolving the contradiction between ease of operation and coating uniformity.
3Device complexity
If traditional overflow tank configuration is used, then the system structure is simple, but the exchange rate of electroplating solution is insufficient and missing plating or false plating occurs on complex parts
Solution Approach 1:
The overflow tank is segmented into multiple functional zones with independent flow control. The electroplating solution is divided into multiple flow paths, with some flowing from bottom to top for level control and others directed parallel to the power line for strong impact on complex structures. This segmentation maintains relatively simple system structure while significantly improving plating completeness.
Solution Approach 2:
The invention adds a new flow dimension by directing electroplating solution parallel to the electric field power line, creating a second independent flow direction alongside the traditional bottom-to-top flow. This dimensional addition improves solution exchange rate and coverage on complex parts without substantially increasing system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances electroplating efficiency and uniformity, improving coating adhesion and finish on complex parts by ensuring consistent solution flow and impact, reducing issues like thin coatings and missing plating on high-speed moving workpieces.
Implementation Method 1
a flow direction of the electroplating solution ejected from the nozzle is substantially parallel to a direction of a power line formed by the first anode and the cathode
Implementation Method 2
electroplating copper, nickel, tin, gold, silver and related alloy on a workpiece such as a connecting terminal
Implementation Method 3
the workpiece is subject to electroplating, water washing and other processes between different overflow tanks
Implementation Method 4
the electroplating solution overflowing from the overflow tank flows back to the mother tank through a pump
Data Source
AI summary
An electroplating device includes an electroplating bath containing an electroplating solution into which a workpiece to be electroplated as a cathode is at least partially immersed, a first anode provided in the electroplating bath, and a liquid spraying device. The liquid spraying device includes a main body part having at least one inlet for conveying the electroplating solution into the main body part, and a plurality of nozzles installed on the main body part. At least part of the nozzles are positioned such that a flow direction of the electroplating solution ejected from the nozzle is substantially parallel to a direction of a power line formed by the first anode and the cathode.