Electroplating Nozzle Pivoting for Circuit Board Dead-Angle Coverage
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Solution Overview
Problem
The existing jet plating method in electroplating processes has limited spraying range, resulting in dead angles on circuit boards that cannot be effectively covered, leading to poor electroplating quality.
Innovation Solution
An electroplating fluid disturbance device with a pivoting mechanism, comprising a supporting plate, linking member, and pivoting member, allows the nozzle to swing and spray electroplating fluid obliquely, increasing the spraying range to cover dead angles on circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the nozzle sprays head-on and linearly in operation, then the spraying mechanism is simple, but the spraying range is limited and dead angles cannot be covered
Solution Approach 1:
The nozzle is transformed from a fixed linear spraying position to a dynamically movable position through the pivoting member and linking member mechanism. The nozzle can now swing between different angles (including head-on and oblique positions) and move along the arc trajectory, converting a static spraying system into a dynamic one that adapts to different spraying needs and covers larger areas including dead angles.
Solution Approach 2:
The spraying motion is extended from one-dimensional linear movement to two-dimensional arc-shaped movement by adding the pivoting mechanism. The nozzle not only moves forward linearly but also swings laterally along an arc trajectory, adding a lateral dimension to the spraying coverage and enabling access to dead angles that were previously unreachable.
2Device complexity
If the nozzle sprays head-on and linearly, then the device structure is simple, but electroplating quality is affected due to blind areas
Solution Approach 1:
The device incorporates a pivoting member that enables the nozzle to dynamically adjust its spraying angle and position. This dynamic capability allows the nozzle to reach previously inaccessible dead angles on the circuit board, ensuring complete coverage and uniform electroplating quality without compromising device structure simplicity.
Solution Approach 2:
The nozzle system is designed to perform multiple functions: it can spray head-on for direct coverage and swing to oblique angles for reaching dead angles. This multi-functionality ensures comprehensive electroplating coverage across different board geometries while maintaining a relatively simple device structure through the use of a compact pivoting mechanism.
3Device complexity
If the nozzle is fixed in position, then the device structure is simple, but the spraying coverage cannot reach dead angles on the circuit board
Solution Approach 1:
The nozzle is equipped with a pivoting member that enables it to swing between different angular positions and follow an arc-shaped trajectory. This dynamic positioning capability allows the nozzle to extend its spraying coverage to include dead angles and recessed areas of the circuit board while maintaining a simple device structure through the efficient design of the pivoting mechanism.
Solution Approach 2:
The spraying coverage is expanded from a single linear path to a two-dimensional arc-shaped region by introducing the pivoting motion. The nozzle can now spray not only forward along the linear path but also sweep laterally along the arc trajectory, effectively covering dead angles and expanding the overall spraying coverage area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device ensures uniform distribution of metal ions, improving the electroplating quality by covering previously unsprayed areas, thereby enhancing the overall electroplating process.
Implementation Method 1
A first end of the pivoting member is pivoted to the pivoting portion of the first supporting plate, and a second end of the pivoting member, which is opposite to the first end, is connected to the spout and the first portion of the linking member. When the first portion of the linking member moves, the pivoting member rotates relative to the pivoting portion, and the spout moves along with the first portion of the linking member, allowing the nozzle of the spout to swing to disturb the electroplating fluid.
Data Source
AI summary
An electroplating fluid disturbance device includes a first supporting plate, a linking member, a spout and a pivoting member. The first supporting plate has a pivoting portion. A first portion of the linking member is close to the pivoting portion of the first supporting plate. The spout is located on the linking member. The spout has a nozzle. The nozzle is configured to be immersed in the electroplating fluid. One end of the pivoting member is pivoted to the pivoting portion of the first supporting plate. The other end of the pivoting member connects to the spout and the first portion of the linking member. When the first portion of the linking member moves, the pivoting member rotates relative to the pivoting portion and the spout moves along with the first portion of the linking member, so that the nozzle of the spout rotates to disturb the electroplating fluid.