Electroplating Panel with Electric Field Compensation Structure
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Solution Overview
Problem
As semiconductor substrates become larger, the electroplating process often results in non-uniform electroplating layers and warped substrates due to variations in the electric field across the substrate, which current methods struggle to address effectively.
Innovation Solution
A panel with an electric field compensation structure, featuring a substrate with units to be plated and surrounding electric field compensation patterns, is used in conjunction with an electroplating process that includes a cathode and an anode, where the ratio of the area of the first patterns to the second patterns is between 1:0.07 to 1:0.3, ensuring uniform electric field distribution and stabilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate size is increased to reduce cost and improve productivity, then the manufacturing efficiency and cost-effectiveness are improved, but the electric field distribution becomes non-uniform causing warped substrates and defective electroplating layers
Solution Approach 1:
The patent applies local quality by introducing an electric field compensation structure with specific patterns (such as mesh patterns, grid patterns, or dotted patterns) at predetermined locations on the substrate. These compensation patterns have different electrical conductivity characteristics compared to the main circuit patterns, allowing localized adjustment of the electric field distribution. The compensation structure is designed with specific area ratios (e.g., 1:0.07 to 1:0.3) and spatial arrangements to counterbalance the non-uniform electric field effects that occur with large substrate sizes, thereby achieving uniform electroplating thickness across the entire substrate surface.
2Device complexity
If conventional electroplating methods are used on large substrates, then the process simplicity is maintained, but the electroplating layer becomes non-uniform and substrates warp
Solution Approach 1:
The patent implements preliminary action by pre-designing and forming the electric field compensation structure on the substrate before the electroplating process begins. The compensation patterns are created during the circuit board manufacturing process (e.g., as part of the copper foil lamination or etching process), so that when the substrate enters the electroplating process, the compensation structure is already in place to automatically correct the electric field distribution. This approach eliminates the need for complex real-time adjustments or modifications to the electroplating equipment itself, maintaining process simplicity while achieving uniform electroplating results on large substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly enhances the uniformity of the electroplating layer, improving thickness uniformity to 90% or above and reducing defects, effectively addressing the issue of non-uniform electric field distribution on large substrates during the electroplating process.
Implementation Method 1
an electroplating layer made of the electroplating material is formed on the first pattern to be plated of the units to be plated and the second pattern to be plated of the electric field compensation structure of the panel to be plated by the electroplating device
Data Source
AI summary
A panel to be plated is provided. The panel includes a substrate and an electric field compensation structure. The substrate includes a plurality of units to be plated each including a first pattern to be plated. The electric field compensation structure is disposed on the substrate. The electric field compensation structure includes a second pattern to be plated surrounding at least one of the units to be plated. A ratio of an area of the first pattern to be plated of the units to be plated to an area of the second pattern to be plated of the electric field compensation structure is in a range from 1:0.07 to 1:0.3.